TY - GEN
T1 - Development of silicon grating-to-grating coupling technology and demonstration of fan-in/fan-out for multi-core fiber applications
AU - Pashkova, Tatiana
AU - O'Brien, Peter
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/12
Y1 - 2019/12
N2 - Motivated by the potential applications of the multicore fibers (MCFs), we presented a compact solution for dense on-chip interconnects utilizing grating-to-grating coupling technology. In this work, we designed, fabricated and performed measurements of compact chip-based fan-in/fan-out structures fabricated on a silicon chip. We demonstrated a miniaturized chip-based component that can be applicable as an interposer for coupling light from 7-core MCF to individual channels on chip or as a chip-to-chip link between photonic integrated circuits (PICs).
AB - Motivated by the potential applications of the multicore fibers (MCFs), we presented a compact solution for dense on-chip interconnects utilizing grating-to-grating coupling technology. In this work, we designed, fabricated and performed measurements of compact chip-based fan-in/fan-out structures fabricated on a silicon chip. We demonstrated a miniaturized chip-based component that can be applicable as an interposer for coupling light from 7-core MCF to individual channels on chip or as a chip-to-chip link between photonic integrated circuits (PICs).
UR - https://www.scopus.com/pages/publications/85082997600
U2 - 10.1109/EPTC47984.2019.9026667
DO - 10.1109/EPTC47984.2019.9026667
M3 - Conference proceeding
AN - SCOPUS:85082997600
T3 - 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
SP - 582
EP - 585
BT - 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE Electronics Packaging Technology Conference, EPTC 2019
Y2 - 4 December 2019 through 6 December 2019
ER -