@inproceedings{c82528ca05344ed1bdcbfaa5578319a4,
title = "Development of Transfer-Printed III-V C-Band Lasers on Silicon Photonic Integrated Circuits for Multi-Project Wafer Offering",
abstract = "Integrating optical gain media remains a significant challenge in silicon photonics. This work demonstrates the hybrid integration of C-band lasers into the AIM Photonics 300 mm multi-project wafer foundry platform by micro-transfer printing. Micro-transfer printing is a thin film, wafer-scale, pick-and-place technique that requires lasers to be fabricated with an etch release layer to free the device from the III-V substrate. The source lasers and the target cavity on the silicon photonics integrated circuit required co-process development to enable a butt-coupled integrated package. Laser powers of ∼ 0. 5 milliwatts were coupled into the photonic circuit.",
keywords = "Hybrid Integration, Lasers, Micro-Transfer Printing, Silicon Photonics",
author = "Nelson, \{George T.\} and James Ocallaghan and Colin Mcdonough and Preble, \{Stefan F.\} and Padraic Morrissey and Christopher Striemer and Peter Obrien and David Harame",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 75th IEEE Electronic Components and Technology Conference, ECTC 2025 ; Conference date: 27-05-2025 Through 30-05-2025",
year = "2025",
doi = "10.1109/ECTC51687.2025.00106",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "600--604",
booktitle = "Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025",
address = "United States",
}