Developments in microsystems (MST) for electronics in Europe

Sean Cian O. Mathúna; Terence O'Donnell; Padraig Hughes; Martin Hill; Bill Lane

Developments in microsystems (MST) for electronics in Europe

Sean Cian O. Mathúna
, Terence O'Donnell
, Padraig Hughes
, Martin Hill
, Bill Lane

Tyndall IPES (Integrated Power)

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents a review of recent developments in Europe in the area of microsystems-related activities (referred to by the acronym, MST in Europe). In particular it focuses on the replacement of passive components by devices fabricated using MST techniques. MST replacements for switches and magnetic components are discussed in detail. The emerging area of MOEMS or optical MEMS is also introduced. The paper also addresses MST packaging in the context of the traditional electronic packaging community who will in the future, have to address the integration and assembly of MST components and sub-systems into new product development programmes.

Original language	English
Pages (from-to)	98-103
Number of pages	6
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4217
Publication status	Published - 2002
Event	2000 HD International Conference on High-Density Interconnect and Systems Packaging - Denver, CO, United States Duration: 25 Apr 2000 → 28 Apr 2000

Keywords

Electronics
MEMS
Microswitch
Microsystems
MST
NEXUS

Cite this

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title = "Developments in microsystems (MST) for electronics in Europe",

abstract = "This paper presents a review of recent developments in Europe in the area of microsystems-related activities (referred to by the acronym, MST in Europe). In particular it focuses on the replacement of passive components by devices fabricated using MST techniques. MST replacements for switches and magnetic components are discussed in detail. The emerging area of MOEMS or optical MEMS is also introduced. The paper also addresses MST packaging in the context of the traditional electronic packaging community who will in the future, have to address the integration and assembly of MST components and sub-systems into new product development programmes.",

keywords = "Electronics, MEMS, Microswitch, Microsystems, MST, NEXUS",

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journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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T1 - Developments in microsystems (MST) for electronics in Europe

AU - Mathúna, Sean Cian O.

AU - O'Donnell, Terence

AU - Hughes, Padraig

AU - Hill, Martin

AU - Lane, Bill

PY - 2002

Y1 - 2002

N2 - This paper presents a review of recent developments in Europe in the area of microsystems-related activities (referred to by the acronym, MST in Europe). In particular it focuses on the replacement of passive components by devices fabricated using MST techniques. MST replacements for switches and magnetic components are discussed in detail. The emerging area of MOEMS or optical MEMS is also introduced. The paper also addresses MST packaging in the context of the traditional electronic packaging community who will in the future, have to address the integration and assembly of MST components and sub-systems into new product development programmes.

AB - This paper presents a review of recent developments in Europe in the area of microsystems-related activities (referred to by the acronym, MST in Europe). In particular it focuses on the replacement of passive components by devices fabricated using MST techniques. MST replacements for switches and magnetic components are discussed in detail. The emerging area of MOEMS or optical MEMS is also introduced. The paper also addresses MST packaging in the context of the traditional electronic packaging community who will in the future, have to address the integration and assembly of MST components and sub-systems into new product development programmes.

KW - Electronics

KW - MEMS

KW - Microswitch

KW - Microsystems

KW - MST

KW - NEXUS

UR - https://www.scopus.com/pages/publications/0036386838

M3 - Article

AN - SCOPUS:0036386838

SN - 0277-786X

VL - 4217

SP - 98

EP - 103

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - 2000 HD International Conference on High-Density Interconnect and Systems Packaging

Y2 - 25 April 2000 through 28 April 2000

ER -

Developments in microsystems (MST) for electronics in Europe

Abstract

Keywords

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