Dielectric-free fabrication of compact 30-GHz photodetectors using the isolated pedestal contact configuration

Chris L.M. Daunt; Hua Yang; Wei Han; Kevin Thomas; Emanuele Pelucchi; Brian Corbett; Frank H. Peters

doi:10.1109/LPT.2012.2194484

Dielectric-free fabrication of compact 30-GHz photodetectors using the isolated pedestal contact configuration

Chris L.M. Daunt
, Hua Yang
, Wei Han
, Kevin Thomas
, Emanuele Pelucchi
, Brian Corbett
, Frank H. Peters

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.

Original language	English
Article number	6180186
Pages (from-to)	1082-1084
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	24
Issue number	13
DOIs	https://doi.org/10.1109/LPT.2012.2194484
Publication status	Published - 2012

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Optical device fabrication
photodetectors
photodiodes

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10.1109/LPT.2012.2194484

Cite this

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title = "Dielectric-free fabrication of compact 30-GHz photodetectors using the isolated pedestal contact configuration",

abstract = "We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.",

keywords = "Optical device fabrication, photodetectors, photodiodes",

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year = "2012",

doi = "10.1109/LPT.2012.2194484",

language = "English",

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pages = "1082--1084",

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T1 - Dielectric-free fabrication of compact 30-GHz photodetectors using the isolated pedestal contact configuration

AU - Daunt, Chris L.M.

AU - Yang, Hua

AU - Han, Wei

AU - Thomas, Kevin

AU - Pelucchi, Emanuele

AU - Corbett, Brian

AU - Peters, Frank H.

PY - 2012

Y1 - 2012

N2 - We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.

AB - We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.

KW - Optical device fabrication

KW - photodetectors

KW - photodiodes

UR - https://www.scopus.com/pages/publications/84861755893

U2 - 10.1109/LPT.2012.2194484

DO - 10.1109/LPT.2012.2194484

M3 - Article

AN - SCOPUS:84861755893

SN - 1041-1135

VL - 24

SP - 1082

EP - 1084

JO - IEEE Photonics Technology Letters

JF - IEEE Photonics Technology Letters

IS - 13

M1 - 6180186

ER -

Dielectric-free fabrication of compact 30-GHz photodetectors using the isolated pedestal contact configuration

Abstract

UN SDGs

Keywords

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