Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency

S. Saini; I. Fay; T. Morrisey; J. Krambeck; A. Gupta; M. Hall; A. Agarwal; P. O'brien; E. A. Unger; G. Norris; R. Kirchain; L. C. Kimerling

doi:10.1109/ETOP64842.2025.11030707

Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency

S. Saini
, I. Fay
, T. Morrisey
, J. Krambeck
, A. Gupta
, M. Hall
, A. Agarwal
, P. O'brien
, E. A. Unger
, G. Norris
, R. Kirchain
, L. C. Kimerling

Massachusetts Institute of Technology

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

As Co-Packaged Optics drives advanced packaging solutions for data centers, AI computing, and sensing/imaging systems, digital twins and digital games offer just-in-time training support for rapid reskill/upskill of engineers and technicians. Recent advances in digital twins of select packaging tools for CPO (fiber-attach, die saw, die bonder) will be presented with early results on learner experience within a bootcamp based setting. In addition, learner results will be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This new photonics education frontier expands CPO curricula to emphasize broad training in the resource flows of the semiconductor manufacturing supply chain, to assess enabling integrated photonics solutions for systems, and in fabrication or packaging.

Original language	English
Title of host publication	2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798331543013
DOIs	https://doi.org/10.1109/ETOP64842.2025.11030707
Publication status	Published - 2025
Event	2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Glasgow, United Kingdom Duration: 19 May 2025 → 22 May 2025

Publication series

Name	2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings

Conference

Conference	2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025
Country/Territory	United Kingdom
City	Glasgow
Period	19/05/25 → 22/05/25

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure
SDG 12 Responsible Consumption and Production

Keywords

digital games
digital twins
integrated photonics
Life Cycle Thinking
semiconductor resource-efficiency

Access to Document

10.1109/ETOP64842.2025.11030707

Cite this

Saini, S., Fay, I., Morrisey, T., Krambeck, J., Gupta, A., Hall, M., Agarwal, A., O'brien, P., Unger, E. A., Norris, G., Kirchain, R., & Kimerling, L. C. (2025). Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency. In 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings (2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ETOP64842.2025.11030707

Saini, S. ; Fay, I. ; Morrisey, T. et al. / Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency. 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2025. (2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings).

@inproceedings{dcf53cd9caac49dab813e41282ada17d,

title = "Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency",

abstract = "As Co-Packaged Optics drives advanced packaging solutions for data centers, AI computing, and sensing/imaging systems, digital twins and digital games offer just-in-time training support for rapid reskill/upskill of engineers and technicians. Recent advances in digital twins of select packaging tools for CPO (fiber-attach, die saw, die bonder) will be presented with early results on learner experience within a bootcamp based setting. In addition, learner results will be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This new photonics education frontier expands CPO curricula to emphasize broad training in the resource flows of the semiconductor manufacturing supply chain, to assess enabling integrated photonics solutions for systems, and in fabrication or packaging.",

keywords = "digital games, digital twins, integrated photonics, Life Cycle Thinking, semiconductor resource-efficiency",

author = "S. Saini and I. Fay and T. Morrisey and J. Krambeck and A. Gupta and M. Hall and A. Agarwal and P. O'brien and Unger, \{E. A.\} and G. Norris and R. Kirchain and Kimerling, \{L. C.\}",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 ; Conference date: 19-05-2025 Through 22-05-2025",

year = "2025",

doi = "10.1109/ETOP64842.2025.11030707",

language = "English",

series = "2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings",

address = "United States",

}

Saini, S, Fay, I, Morrisey, T, Krambeck, J, Gupta, A, Hall, M, Agarwal, A, O'brien, P, Unger, EA, Norris, G, Kirchain, R & Kimerling, LC 2025, Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency. in 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings. 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025, Glasgow, United Kingdom, 19/05/25. https://doi.org/10.1109/ETOP64842.2025.11030707

Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency. / Saini, S.; Fay, I.; Morrisey, T. et al.
2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2025. (2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency

AU - Saini, S.

AU - Fay, I.

AU - Morrisey, T.

AU - Krambeck, J.

AU - Gupta, A.

AU - Hall, M.

AU - Agarwal, A.

AU - O'brien, P.

AU - Unger, E. A.

AU - Norris, G.

AU - Kirchain, R.

AU - Kimerling, L. C.

PY - 2025

Y1 - 2025

N2 - As Co-Packaged Optics drives advanced packaging solutions for data centers, AI computing, and sensing/imaging systems, digital twins and digital games offer just-in-time training support for rapid reskill/upskill of engineers and technicians. Recent advances in digital twins of select packaging tools for CPO (fiber-attach, die saw, die bonder) will be presented with early results on learner experience within a bootcamp based setting. In addition, learner results will be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This new photonics education frontier expands CPO curricula to emphasize broad training in the resource flows of the semiconductor manufacturing supply chain, to assess enabling integrated photonics solutions for systems, and in fabrication or packaging.

AB - As Co-Packaged Optics drives advanced packaging solutions for data centers, AI computing, and sensing/imaging systems, digital twins and digital games offer just-in-time training support for rapid reskill/upskill of engineers and technicians. Recent advances in digital twins of select packaging tools for CPO (fiber-attach, die saw, die bonder) will be presented with early results on learner experience within a bootcamp based setting. In addition, learner results will be presented for a digital game that trains in Life Cycle Thinking for resource-efficient manufacturing. This new photonics education frontier expands CPO curricula to emphasize broad training in the resource flows of the semiconductor manufacturing supply chain, to assess enabling integrated photonics solutions for systems, and in fabrication or packaging.

KW - digital games

KW - digital twins

KW - integrated photonics

KW - Life Cycle Thinking

KW - semiconductor resource-efficiency

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AN - SCOPUS:105009406126

T3 - 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings

BT - 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025

Y2 - 19 May 2025 through 22 May 2025

ER -

Saini S, Fay I, Morrisey T, Krambeck J, Gupta A, Hall M et al. Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency. In 2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2025. (2025 IEEE Conference on Education and Training in Optics and Photonics, ETOP 2025 - Proceedings). doi: 10.1109/ETOP64842.2025.11030707

Digital Twin and Digital Game-Based Training in Integrated Photonics and Semiconductor Resource-Efficiency

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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Cite this