Do we have to worry about extended defects in high-mobility materials?

  • Eddy Simoen
  • , Po Chun Hsu
  • , Liang He
  • , Yves Mols
  • , Bernadette Kunert
  • , Robert Langer
  • , Niamh Waldron
  • , Geert Eneman
  • , Nadine Collaert
  • , Mark Heyns
  • , Cor Claeys

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

An overview is given on how to tackle the question of the electrical activity of extended defects which are inevitably present in hetero-epitaxial III-V layers on silicon. Analysis methods are described which rely on simple device structures containing a specific type of extended defect (here, threading dislocations). Applying the same methods to real scaled FinFETs is rather challenging. Instead Generation-Recombination noise spectroscopy provides data that can be compared with other more standard techniques, like Deep-Level Transient Spectroscopy (DLTS) in order to identify the presence of an electrically active extended defect in the channel material.

Original languageEnglish
Title of host publicationChina Semiconductor Technology International Conference 2018, CSTIC 2018
EditorsHanming Wu, Peilin Song, Qinghuang Lin, Yuchun Wang, Cor Claeys, Hsiang-Lang Lung, Ying Zhang, Steve Liang, Yiyu Shi, Ru Huang, Zhen Guo, Kafai Lai
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781538653081
DOIs
Publication statusPublished - 29 May 2018
Externally publishedYes
Event2018 China Semiconductor Technology International Conference, CSTIC 2018 - Shanghai, China
Duration: 11 Mar 201812 Mar 2018

Publication series

NameChina Semiconductor Technology International Conference 2018, CSTIC 2018

Conference

Conference2018 China Semiconductor Technology International Conference, CSTIC 2018
Country/TerritoryChina
CityShanghai
Period11/03/1812/03/18

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