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Doping strategies for FinFETs

  • Bartek J. Pawlak
  • , Ray Duffy
  • , An De Keersgieter

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper the formation strategies for source and drain regions in vertical FinFETs are discussed. The technology challenges are very different than for planar bulk devices. Here the main doping approaches are presented with their advantages and drawbacks. Source/drain formation by ion implantation, and deposition techniques are discussed with respect to process simplicity, and device requirements.

Original languageEnglish
Title of host publicationRapid Thermal Processing and Beyond
Subtitle of host publicationApplications in Semiconductor Processing - Selected papers from RTP specialists all over the world
PublisherTrans Tech Publications Ltd
Pages333-338
Number of pages6
ISBN (Electronic)9780878493609
DOIs
Publication statusPublished - 2008
Externally publishedYes

Publication series

NameMaterials Science Forum
Volume573-574
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Keywords

  • 3D devices
  • Deposition techniques
  • Doping
  • FinFET
  • Ion implantation
  • Short channel effect

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