Electrically active interface defects in the (100)Si/SiO x/HfO2/TiN system: Origin, instabilities and passivation

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

An analysis of the origin and passivation of interface states in (100)Si/SiOx/HfO2/TiN capacitor structures is presented. For high-k gate/metal gate capacitors which exhibit relatively high interface state densities (> 1×1011cm-2) the dominant interfacial defects are silicon dangling bond (Pbo) centres. For (100)Si/SiOx/HfO2/TiN capacitors which experience no high temperature thermal budget following HfO2/TiN gate formation (T<600°C), the devices exhibit instabilities, where the interface state densities are modified during electrical measurements. The origin of this instability is studied. The response of the interface state density to rapid thermal annealing (30s) in N2 over the temperature range 600-900°C is presented. In addition, results are presented for interface state passivation in forming gas (0.5H2/0.95N2) from 350-550°C for (100)Si/SiOx/HfO2/TiN gate stacks with no post deposition annealing following TiN gate formation and for devices following a 900°C, 30s N2 RTA. copyright The Electrochemical Society.

Original languageEnglish
Title of host publicationPhysics and Technology of High-k Gate Dielectrics 4
PublisherElectrochemical Society Inc.
Pages97-110
Number of pages14
Edition3
ISBN (Electronic)1566775035
DOIs
Publication statusPublished - 2006
EventPhysics and Technology of High-k Gate Dielectrics 4 - 210th Electrochemical Society Meeting - Cancun, Mexico
Duration: 29 Oct 20063 Nov 2006

Publication series

NameECS Transactions
Number3
Volume3
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferencePhysics and Technology of High-k Gate Dielectrics 4 - 210th Electrochemical Society Meeting
Country/TerritoryMexico
CityCancun
Period29/10/063/11/06

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