@inproceedings{591815dc63294a2b803b9b77e18771f7,
title = "Electroless cobalt deposition from ammonia borane solutions",
abstract = "Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrates. The bath composition for selective deposition were investigated. The mobile ion free plating bath was pH balanced and buffered using tetramethyl ammonium hydroxide. The codeposition of W with the Co was achieved utilising tungstic acid. The electrochemical analysis of the cobalt deposition and AB oxidation at the operating pH of 9 indicate that the AB oxidation on copper is faster than that on cobalt and that the reaction rate decreases as the deposition proceeds. copyright The Electrochemical Society.",
author = "Nagle, \{Lorraine C.\} and Alan Loughlin and Rohan, \{James F.\}",
year = "2006",
doi = "10.1149/1.2408863",
language = "English",
isbn = "9781566775175",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "6",
pages = "51--59",
booktitle = "Electrochemical Processing in ULSI and MEMS 2",
address = "United States",
edition = "6",
note = "209th ECS Meeting ; Conference date: 07-05-2006 Through 11-05-2006",
}