Electromagnetic optimization of high-speed TO laser modules

Wei Han; Peter O'Brien; Marc Resing; Hua Yang; Frank H. Peters

doi:10.1117/12.870549

Electromagnetic optimization of high-speed TO laser modules

Wei Han
, Peter O'Brien
, Marc Resing
, Hua Yang
, Frank H. Peters

University College Cork

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.

Original language	English
Title of host publication	Semiconductor Lasers and Applications IV
DOIs	https://doi.org/10.1117/12.870549
Publication status	Published - 2010
Event	Semiconductor Lasers and Applications IV - Beijing, China Duration: 18 Oct 2010 → 19 Oct 2010

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	7844
ISSN (Print)	0277-786X

Conference

Conference	Semiconductor Lasers and Applications IV
Country/Territory	China
City	Beijing
Period	18/10/10 → 19/10/10

Keywords

Electromagnetic optimization
High-speed module
RF package
To-can

Access to Document

10.1117/12.870549

Cite this

@inproceedings{d2ad0f6cfebe4cf2865de60994483b12,

title = "Electromagnetic optimization of high-speed TO laser modules",

abstract = "The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.",

keywords = "Electromagnetic optimization, High-speed module, RF package, To-can",

author = "Wei Han and Peter O'Brien and Marc Resing and Hua Yang and Peters, \{Frank H.\}",

year = "2010",

doi = "10.1117/12.870549",

language = "English",

isbn = "9780819483744",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

booktitle = "Semiconductor Lasers and Applications IV",

note = "Semiconductor Lasers and Applications IV ; Conference date: 18-10-2010 Through 19-10-2010",

}

TY - GEN

T1 - Electromagnetic optimization of high-speed TO laser modules

AU - Han, Wei

AU - O'Brien, Peter

AU - Resing, Marc

AU - Yang, Hua

AU - Peters, Frank H.

PY - 2010

Y1 - 2010

N2 - The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.

AB - The packaging aspect of the high-speed TO laser module has been investigated in this paper. A conventional TO 56 package is employed for compact and low cost high-speed applications. In the TO header, a special designed RF substrate is developed to minimize the RF reflection and insert loss. The influence of the feedthrough and the TO leads on signal transmission is analyzed using the electromagnetic (EM) method. A testing interface PCB based on the tapered coplanar waveguide (CPW) transmission line is proposed, and simulation results indicate that the coaxial type TO package has an insert loss of 1.5dB at 10GHz. In order to improve the electronic performance of the TO module, the equivalent circuit is built and a bandwidth compensation circuit is introduced, and results show that the 3dB bandwidth of the TO package can extend to 16.3GHz.

KW - Electromagnetic optimization

KW - High-speed module

KW - RF package

KW - To-can

UR - https://www.scopus.com/pages/publications/78751527383

U2 - 10.1117/12.870549

DO - 10.1117/12.870549

M3 - Conference proceeding

AN - SCOPUS:78751527383

SN - 9780819483744

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Semiconductor Lasers and Applications IV

T2 - Semiconductor Lasers and Applications IV

Y2 - 18 October 2010 through 19 October 2010

ER -

Electromagnetic optimization of high-speed TO laser modules

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Keywords

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