@inproceedings{cf44ea0066c74b108e2518a460be4979,
title = "Etch and wet clean challenges and joint optimization",
abstract = "The emergence of new integration schemes and materials for advanced technology nodes has presented greater challenges to both etch and post etch wet clean. The mutual interactions between etch and clean processes must be considered, thus having both etch and clean process optimized together has become more essential and beneficial in order to provide the optimized process solution.",
author = "B. Yen and J. Lin and C. Lee and M. Hegarty and P. Loewenhardt",
year = "2011",
doi = "10.1149/1.3567669",
language = "English",
isbn = "9781607682356",
series = "ECS Transactions",
number = "1",
pages = "755--760",
booktitle = "China Semiconductor Technology International Conference 2011, CSTIC 2011",
edition = "1",
note = "10th China Semiconductor Technology International Conference 2011, CSTIC 2011 ; Conference date: 13-03-2011 Through 14-03-2011",
}