Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices

Swatchith Lal; Devendraprakash Gautam; Kafil M. Razeeb

doi:10.1109/NANO.2018.8626304

Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices

Swatchith Lal
, Devendraprakash Gautam
, Kafil M. Razeeb

University College Cork

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

The work demonstrates and discusses the fabrication of micro thermoelectric cooler (μ -TEC) for thermal management of photonic devices. The device is fabricated using cost-effective electrodeposition technique on silicon wafer with 210 pairs of the electrodeposited p-type BiSbTe and n-type BiTe pillars. The complete device is fabricated using flip-chip bonding technique. We discuss the challenges in device fabrication and solutions employed to successfully construct the device.

Original language	English
Title of host publication	18th International Conference on Nanotechnology, NANO 2018
Publisher	IEEE Computer Society
ISBN (Electronic)	9781538653364
DOIs	https://doi.org/10.1109/NANO.2018.8626304
Publication status	Published - 2 Jul 2018
Event	18th International Conference on Nanotechnology, NANO 2018 - Cork, Ireland Duration: 23 Jul 2018 → 26 Jul 2018

Publication series

Name	Proceedings of the IEEE Conference on Nanotechnology
Volume	2018-July
ISSN (Print)	1944-9399
ISSN (Electronic)	1944-9380

Conference

Conference	18th International Conference on Nanotechnology, NANO 2018
Country/Territory	Ireland
City	Cork
Period	23/07/18 → 26/07/18

Access to Document

10.1109/NANO.2018.8626304

Cite this

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title = "Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices",

abstract = "The work demonstrates and discusses the fabrication of micro thermoelectric cooler (μ -TEC) for thermal management of photonic devices. The device is fabricated using cost-effective electrodeposition technique on silicon wafer with 210 pairs of the electrodeposited p-type BiSbTe and n-type BiTe pillars. The complete device is fabricated using flip-chip bonding technique. We discuss the challenges in device fabrication and solutions employed to successfully construct the device.",

author = "Swatchith Lal and Devendraprakash Gautam and Razeeb, \{Kafil M.\}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 18th International Conference on Nanotechnology, NANO 2018 ; Conference date: 23-07-2018 Through 26-07-2018",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/NANO.2018.8626304",

language = "English",

series = "Proceedings of the IEEE Conference on Nanotechnology",

publisher = "IEEE Computer Society",

booktitle = "18th International Conference on Nanotechnology, NANO 2018",

address = "United States",

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Lal, S, Gautam, D & Razeeb, KM 2018, Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices. in 18th International Conference on Nanotechnology, NANO 2018., 8626304, Proceedings of the IEEE Conference on Nanotechnology, vol. 2018-July, IEEE Computer Society, 18th International Conference on Nanotechnology, NANO 2018, Cork, Ireland, 23/07/18. https://doi.org/10.1109/NANO.2018.8626304

Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices. / Lal, Swatchith; Gautam, Devendraprakash; Razeeb, Kafil M.
18th International Conference on Nanotechnology, NANO 2018. IEEE Computer Society, 2018. 8626304 (Proceedings of the IEEE Conference on Nanotechnology; Vol. 2018-July).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices

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AU - Gautam, Devendraprakash

AU - Razeeb, Kafil M.

PY - 2018/7/2

Y1 - 2018/7/2

N2 - The work demonstrates and discusses the fabrication of micro thermoelectric cooler (μ -TEC) for thermal management of photonic devices. The device is fabricated using cost-effective electrodeposition technique on silicon wafer with 210 pairs of the electrodeposited p-type BiSbTe and n-type BiTe pillars. The complete device is fabricated using flip-chip bonding technique. We discuss the challenges in device fabrication and solutions employed to successfully construct the device.

AB - The work demonstrates and discusses the fabrication of micro thermoelectric cooler (μ -TEC) for thermal management of photonic devices. The device is fabricated using cost-effective electrodeposition technique on silicon wafer with 210 pairs of the electrodeposited p-type BiSbTe and n-type BiTe pillars. The complete device is fabricated using flip-chip bonding technique. We discuss the challenges in device fabrication and solutions employed to successfully construct the device.

UR - https://www.scopus.com/pages/publications/85062267696

U2 - 10.1109/NANO.2018.8626304

DO - 10.1109/NANO.2018.8626304

M3 - Conference proceeding

AN - SCOPUS:85062267696

T3 - Proceedings of the IEEE Conference on Nanotechnology

BT - 18th International Conference on Nanotechnology, NANO 2018

PB - IEEE Computer Society

T2 - 18th International Conference on Nanotechnology, NANO 2018

Y2 - 23 July 2018 through 26 July 2018

ER -

Fabrication of micro-thermoelectric cooler for the thermal management of photonic devices

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