Fabrication of micro-thermoelectric devices for power generation and the thermal management of photonic devices

This work demonstrates and discusses the fabrication of cross-plane configured micro thermoelectric devices for the power generation and thermal management of the photonic devices. The device is fabricated using a cost-effective electrodeposition technique on the silicon wafer with 210 pairs of the electrodeposited p-type BiTe and n-type CuTe pillars. The complete device is fabricated using the flip-chip bonding technique. Our focus in this work is on the challenges in the device fabrication and the solutions employed to overcome the obstacles thereby successfully fabricating the micro thermoelectric device.