Abstract
We describe a new method, Field-Configured Assembly (FCA), which enables programmed heterogeneous integration of functional mesoscale devices at technologically relevant substrates. To highlight the potential of this new mesoscale manufacturing method, we show that 50-μm-diameter GaAs-based light-emitting diode devices may be successfully manipulated in a high throughput, tweezer-less manner and assembled at selected receptor electrode sites pattermed onto an electronically addressable silicon chip. Following assembly, devices may be permanently integrated on-chip by solder reflow bonding to enable direct and reliable electrical interfacing.
| Original language | English |
|---|---|
| Pages (from-to) | 3-6 |
| Number of pages | 4 |
| Journal | Materials Science and Engineering C |
| Volume | 23 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 15 Jan 2003 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
-
SDG 9 Industry, Innovation, and Infrastructure
Keywords
- Field-configured assembly
- Heterogenous integration
- Mesoscale manufacturing
- Nanotechnology
- Self-assembly
Fingerprint
Dive into the research topics of 'Field-configured self-assembly: Manufacturing at the mesoscale'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver