FinFET doping; material science, metrology, and process modeling studies for optimized device performance

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this review paper the challenges that face doping optimization in 3-dimensional (3D) thin-body silicon devices will be discussed, within the context of material science studies, metrology methodologies, process modeling insight, ultimately leading to optimized device performance. The focus will be on ion implantation at the method to introduce the dopants to the target material.

Original languageEnglish
Title of host publicationIon Implantation Technology 2010 - 18th International Conference on Ion Implantation Technology, IIT 2010
Pages17-22
Number of pages6
DOIs
Publication statusPublished - 2010
Event18th International Conference on Ion Implantation Technology, IIT 2010 - Kyoto, Japan
Duration: 6 Jun 201011 Jun 2010

Publication series

NameAIP Conference Proceedings
Volume1321
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference18th International Conference on Ion Implantation Technology, IIT 2010
Country/TerritoryJapan
CityKyoto
Period6/06/1011/06/10

Keywords

  • doping
  • FinFETs
  • Ion implantation
  • multi-gate devices

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