First demonstration of III-V HBTs on 300 mm Si substrates using nano-ridge engineering

  • A. Vais
  • , R. Alcotte
  • , M. Ingels
  • , P. Wambacq
  • , B. Parvais
  • , R. Langer
  • , B. Kunert
  • , N. Waldron
  • , N. Collaert
  • , L. Witters
  • , Y. Mols
  • , A. S. Hernandez
  • , A. Walke
  • , H. Yu
  • , M. Baryshnikova
  • , G. Mannaert
  • , V. Deshpande

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper, we demonstrate GaAs/InGaP HBTs grown on a 300 mm Si substrate. A DC current gain of ~112 and breakdown voltage, BVCBO, of 10 V is achieved. The emitter-base and base-collector diodes show an ideality factor of ~1.2 and ~1.4, respectively. This demonstration shows the potential for enabling a hybrid III-V CMOS/ technology for 5G and mm-wave applications, not limited to GaAs but which can also be extended to InGaAs on a 300 mm Si substrate.

Original languageEnglish
Title of host publication2019 IEEE International Electron Devices Meeting, IEDM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728140315
DOIs
Publication statusPublished - Dec 2019
Externally publishedYes
Event65th Annual IEEE International Electron Devices Meeting, IEDM 2019 - San Francisco, United States
Duration: 7 Dec 201911 Dec 2019

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
Volume2019-December
ISSN (Print)0163-1918

Conference

Conference65th Annual IEEE International Electron Devices Meeting, IEDM 2019
Country/TerritoryUnited States
CitySan Francisco
Period7/12/1911/12/19

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