First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

Highlighted is the multi-stack silicon wafer inspection capability of the visible to ShortWave Infrared (SWIR) high linear dynamic range CAOS camera. SWIR experiments successfully image the location of the copper ring metallization between silicon wafers.

Original languageEnglish
Title of host publicationApplied Industrial Optics
Subtitle of host publicationSpectroscopy, Imaging and Metrology, AIO 2022
PublisherOptica Publishing Group (formerly OSA)
ISBN (Electronic)9781957171081
Publication statusPublished - 2022
EventApplied Industrial Optics: Spectroscopy, Imaging and Metrology, AIO 2022 - Dublin, Ireland
Duration: 25 Jul 202227 Jul 2022

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Conference

ConferenceApplied Industrial Optics: Spectroscopy, Imaging and Metrology, AIO 2022
Country/TerritoryIreland
CityDublin
Period25/07/2227/07/22

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