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Fluorine implantation in germanium for dopant diffusion control

  • M. Shayesteh
  • , V. Djara
  • , M. Schmidt
  • , M. White
  • , A. M. Kelleher
  • , Ray Duffy

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

The authors investigate F as a non-dopant co-implant to suppress P and As diffusion in Ge. F was placed either overlaying the dopant profile, or deeper to counteract the influence of end-of-range defects, which is a common ultra-shallow junction optimization approach in Si substrates. It was determined that F outgasses extremely quickly from Ge, as a 1×1015cm -2 implanted dose escaped completely during a rapid thermal anneal as short as 1 sec, at 600°C. This behavior is attributed to rapid diffusion, instability of F-defect clusters, and an aversion of F to reside substitutionally in the Ge lattice. The F diffusivity at 600°C is in the order of some metal impurity diffusivities at that temperature.

Original languageEnglish
Title of host publicationIon Implantation Technology 2012 - Proceedings of the 19th International Conference on Ion Implantation Technology
Pages115-118
Number of pages4
DOIs
Publication statusPublished - 2012
Event19th International Conference on Ion Implantation Technology 2012, IIT 2012 - Valladolid, Spain
Duration: 25 Jun 201229 Jun 2012

Publication series

NameAIP Conference Proceedings
Volume1496
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference19th International Conference on Ion Implantation Technology 2012, IIT 2012
Country/TerritorySpain
CityValladolid
Period25/06/1229/06/12

Keywords

  • arsenic
  • Dopant diffusion
  • fluorine
  • germanium
  • phosphorus

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