From 5G to 6G: Will compound semiconductors make the difference?

  • N. Collaert
  • , A. Alian
  • , A. Banerjee
  • , V. Chauhan
  • , R. Y. Elkashlan
  • , B. Hsu
  • , M. Ingels
  • , A. Khaled
  • , K. Vondkar Kodandarama
  • , B. Kunert
  • , Y. Mols
  • , U. Peralagu
  • , V. Putcha
  • , R. Rodriguez
  • , A. Sibaja-Hernandez
  • , E. Simoen
  • , A. Vais
  • , A. Walke
  • , L. Witters
  • , S. Yadav
  • H. Yu, M. Zhao, P. Wambacq, B. Parvais, N. Waldron

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.

Original languageEnglish
Title of host publication2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
EditorsShaofeng Yu, Xiaona Zhu, Ting-Ao Tang
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728162355
DOIs
Publication statusPublished - 3 Nov 2020
Externally publishedYes
Event15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, China
Duration: 3 Nov 20206 Nov 2020

Publication series

Name2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

Conference

Conference15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
Country/TerritoryChina
CityVirtual, Kunming
Period3/11/206/11/20

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