Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

Original language	English
Title of host publication	Copper Electrodeposition for Nanofabrication of Electronics Devices
DOIs	https://doi.org/10.1007/978-1-4614-9176-7_5
Publication status	Published - 2014

Access to Document

@inbook{f6c6625d5add42fba97005e4e8381990,

title = "Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects",

author = "Rohan, \{James F\} and Damien Thompson",

year = "2014",

doi = "10.1007/978-1-4614-9176-7\_5",

language = "English",

booktitle = "Copper Electrodeposition for Nanofabrication of Electronics Devices",

}