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Ge chemical vapor deposition on GaAs for low resistivity contacts

  • B. Vincent
  • , A. Firrincieli
  • , W. E. Wang
  • , N. Waldron
  • , A. Franquet
  • , B. Douhard
  • , W. Vandervorst
  • , T. Clarysse
  • , G. Brammertz
  • , R. Loo
  • , J. Dekoster
  • , M. Meuris
  • , M. Caymax

Research output: Contribution to journalArticlepeer-review

Abstract

This paper reports the two-dimensional epitaxial growth of thin intrinsic Ge and in-situ doped n-Ge on GaAs substrates by atmospheric pressure chemical vapor deposition. High quality Ge growth on GaAs is activated almost instantly by an optimized pregrowth procedure. Ga autodoping is found to occur within the first Ge monolayers close to the Ge/GaAs interface. The introduction of high P H3 flows during the Ge growth yields the in-situ n-Ge growth on GaAs with an electrically activated dopant concentration of 3× 1019 cm-3. Additionally, n-Ge selective growth on the source/drain areas of an n-GaAs metal oxide semiconductor structure, followed subsequently by the NiGe formation, has been demonstrated to yield an ohmic contact with a contact resistance of 0.13 ωcm.

Original languageEnglish
Pages (from-to)H203-H207
JournalJournal of the Electrochemical Society
Volume158
Issue number3
DOIs
Publication statusPublished - 2011
Externally publishedYes

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