Glob-top reliability characterization: Evaluation and analysis methods

Rory Doyle; Brendan O'Flynn; Willie Lawton; John Barrett; Jason Buckley

Glob-top reliability characterization: Evaluation and analysis methods

Rory Doyle
, Brendan O'Flynn
, Willie Lawton
, John Barrett
, Jason Buckley

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and non-destructive analysis techniques.

Original language	English
Pages (from-to)	169-177
Number of pages	9
Journal	IEEE International Symposium on Polymeric Electronics Packaging, PEP
Publication status	Published - 1997
Event	Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging, PEP'97 - Norrkoping, Sweden Duration: 26 Oct 1997 → 30 Oct 1997

Cite this

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title = "Glob-top reliability characterization: Evaluation and analysis methods",

abstract = "Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and non-destructive analysis techniques.",

author = "Rory Doyle and Brendan O'Flynn and Willie Lawton and John Barrett and Jason Buckley",

year = "1997",

language = "English",

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journal = "IEEE International Symposium on Polymeric Electronics Packaging, PEP",

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AU - Doyle, Rory

AU - O'Flynn, Brendan

AU - Lawton, Willie

AU - Barrett, John

AU - Buckley, Jason

PY - 1997

Y1 - 1997

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AB - Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and non-destructive analysis techniques.

UR - https://www.scopus.com/pages/publications/0031364729

M3 - Article

AN - SCOPUS:0031364729

SN - 1402-9855

SP - 169

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JO - IEEE International Symposium on Polymeric Electronics Packaging, PEP

JF - IEEE International Symposium on Polymeric Electronics Packaging, PEP

Y2 - 26 October 1997 through 30 October 1997

ER -

Glob-top reliability characterization: Evaluation and analysis methods

Abstract

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