Glob-top reliability characterization: Evaluation and analysis methods

Rory Doyle; Brendan O'Flynn; Willie Lawton; John Barrett; Jason Buckley

doi:10.1109/95.705478

Glob-top reliability characterization: Evaluation and analysis methods

Rory Doyle
, Brendan O'Flynn
, Willie Lawton
, John Barrett
, Jason Buckley

Research output: Contribution to journal › Review article › peer-review

Abstract

Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.

Original language	English
Pages (from-to)	292-299
Number of pages	8
Journal	IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume	21
Issue number	2
DOIs	https://doi.org/10.1109/95.705478
Publication status	Published - Jun 1998

Keywords

Encapsulant
Failure analysis
Glob-top
Reliability

Access to Document

10.1109/95.705478

Cite this

@article{8040a588c1aa402ea6cbc0c250258ae1,

title = "Glob-top reliability characterization: Evaluation and analysis methods",

abstract = "Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.",

keywords = "Encapsulant, Failure analysis, Glob-top, Reliability",

author = "Rory Doyle and Brendan O'Flynn and Willie Lawton and John Barrett and Jason Buckley",

year = "1998",

month = jun,

doi = "10.1109/95.705478",

language = "English",

volume = "21",

pages = "292--299",

journal = "IEEE Transactions on Components Packaging and Manufacturing Technology Part A",

issn = "1070-9886",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2",

}

TY - JOUR

T1 - Glob-top reliability characterization

T2 - Evaluation and analysis methods

AU - Doyle, Rory

AU - O'Flynn, Brendan

AU - Lawton, Willie

AU - Barrett, John

AU - Buckley, Jason

PY - 1998/6

Y1 - 1998/6

N2 - Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.

AB - Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.

KW - Encapsulant

KW - Failure analysis

KW - Glob-top

KW - Reliability

UR - https://www.scopus.com/pages/publications/0032094401

U2 - 10.1109/95.705478

DO - 10.1109/95.705478

M3 - Review article

AN - SCOPUS:0032094401

SN - 1070-9886

VL - 21

SP - 292

EP - 299

JO - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

JF - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

IS - 2

ER -

Glob-top reliability characterization: Evaluation and analysis methods

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this