Half-cycle atomic layer deposition reaction study using O3 and H2O oxidation of Al2O3 on In 0.53Ga0.47As

  • B. Brennan
  • , M. Milojevic
  • , H. C. Kim
  • , P. K. Hurley
  • , J. Kim
  • , G. Hughes
  • , R. M. Wallace

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of water and ozone as the oxidant in the atomic layer deposition (ALD) of aluminum oxide on the ammonium-sulfide-passivated In 0.53Ga0.47As As surface is compared using X-ray photoelectron spectroscopy (XPS) after each "half-cycle" of the ALD process. While the first half-cycle of the aluminum precursor tri-methyl aluminum (TMA) reduces the residual native oxides to within detection limits of XPS, the ozone oxidation process causes significant reoxidation of the substrate in comparison to the water-based process. Subsequent TMA pulses fail to remove the excess interfacial oxides caused by ozone oxidation, resulting in the formation of an oxide interlayer.

Original languageEnglish
Pages (from-to)H205-H207
JournalElectrochemical and Solid-State Letters
Volume12
Issue number6
DOIs
Publication statusPublished - 2009

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