Heteroepitaxy of III-V compound semiconductors on silicon for logic applications: Selective area epitaxy in shallow trench isolation structures vs. Direct epitaxy mediated by strain relaxed buffers

  • M. Cantoro
  • , C. Merckling
  • , S. Jiang
  • , W. Guo
  • , N. Waldron
  • , H. Bender
  • , A. Moussa
  • , B. Douhard
  • , W. Vandervorst
  • , M. M. Heyns
  • , J. Dekoster
  • , R. Loo
  • , M. Caymax

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

We report two approaches to integrate high quality III-V templates with low defectivity on Si wafers by epitaxial growth. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagating from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.

Original languageEnglish
Title of host publicationSiGe, Ge, and Related Compounds 5
Subtitle of host publicationMaterials, Processing, and Devices
PublisherElectrochemical Society Inc.
Pages349-355
Number of pages7
Edition9
ISBN (Print)9781607683575
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event5th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 220th ECS Meeting - Honolulu, HI, United States
Duration: 7 Oct 201212 Oct 2012

Publication series

NameECS Transactions
Number9
Volume50
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference5th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 220th ECS Meeting
Country/TerritoryUnited States
CityHonolulu, HI
Period7/10/1212/10/12

Fingerprint

Dive into the research topics of 'Heteroepitaxy of III-V compound semiconductors on silicon for logic applications: Selective area epitaxy in shallow trench isolation structures vs. Direct epitaxy mediated by strain relaxed buffers'. Together they form a unique fingerprint.

Cite this