Heterogeneous integration in silicon photonics through micro-transfer-printing

Jing Zhang; Grigorij Muliuk; Jeroen Goyvaerts; Bahawal Haq; Sulakshna Kumari; Joan Juvert; Camiel Op De Beeck; Bart Kuyken; Joris Van Campenhout; Guy Lepage; Peter Verheyen; Agnieszka Gocalinska; Emanuele Pelucchi; Brian Corbett; Antonio Jose Trindade; Chris Bower; Gunther Roelkens

doi:10.23919/MOC46630.2019.8982786

Heterogeneous integration in silicon photonics through micro-transfer-printing

Jing Zhang
, Grigorij Muliuk
, Jeroen Goyvaerts
, Bahawal Haq
, Sulakshna Kumari
, Joan Juvert
, Camiel Op De Beeck
, Bart Kuyken
, Joris Van Campenhout
, Guy Lepage
, Peter Verheyen
, Agnieszka Gocalinska
, Emanuele Pelucchi
, Brian Corbett
, Antonio Jose Trindade
, Chris Bower
, Gunther Roelkens

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.

Original language	English
Title of host publication	MOC 2019 - 24th Microoptics Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	64-65
Number of pages	2
ISBN (Electronic)	9784863487123
DOIs	https://doi.org/10.23919/MOC46630.2019.8982786
Publication status	Published - Nov 2019
Event	24th Microoptics Conference, MOC 2019 - Toyama, Japan Duration: 17 Nov 2019 → 20 Nov 2019

Publication series

Name	MOC 2019 - 24th Microoptics Conference

Conference

Conference	24th Microoptics Conference, MOC 2019
Country/Territory	Japan
City	Toyama
Period	17/11/19 → 20/11/19

Access to Document

10.23919/MOC46630.2019.8982786

Cite this

Zhang, J., Muliuk, G., Goyvaerts, J., Haq, B., Kumari, S., Juvert, J., De Beeck, C. O., Kuyken, B., Van Campenhout, J., Lepage, G., Verheyen, P., Gocalinska, A., Pelucchi, E., Corbett, B., Trindade, A. J., Bower, C., & Roelkens, G. (2019). Heterogeneous integration in silicon photonics through micro-transfer-printing. In MOC 2019 - 24th Microoptics Conference (pp. 64-65). Article 8982786 (MOC 2019 - 24th Microoptics Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/MOC46630.2019.8982786

@inproceedings{765ac9fcebae4907a35c92a3c5463627,

title = "Heterogeneous integration in silicon photonics through micro-transfer-printing",

abstract = "Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.",

author = "Jing Zhang and Grigorij Muliuk and Jeroen Goyvaerts and Bahawal Haq and Sulakshna Kumari and Joan Juvert and \{De Beeck\}, \{Camiel Op\} and Bart Kuyken and \{Van Campenhout\}, Joris and Guy Lepage and Peter Verheyen and Agnieszka Gocalinska and Emanuele Pelucchi and Brian Corbett and Trindade, \{Antonio Jose\} and Chris Bower and Gunther Roelkens",

note = "Publisher Copyright: {\textcopyright} 2019 The Japan Society of Applied Physics.; 24th Microoptics Conference, MOC 2019 ; Conference date: 17-11-2019 Through 20-11-2019",

year = "2019",

month = nov,

doi = "10.23919/MOC46630.2019.8982786",

language = "English",

series = "MOC 2019 - 24th Microoptics Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "64--65",

booktitle = "MOC 2019 - 24th Microoptics Conference",

address = "United States",

}

Zhang, J, Muliuk, G, Goyvaerts, J, Haq, B, Kumari, S, Juvert, J, De Beeck, CO, Kuyken, B, Van Campenhout, J, Lepage, G, Verheyen, P, Gocalinska, A, Pelucchi, E , Corbett, B, Trindade, AJ, Bower, C & Roelkens, G 2019, Heterogeneous integration in silicon photonics through micro-transfer-printing. in MOC 2019 - 24th Microoptics Conference., 8982786, MOC 2019 - 24th Microoptics Conference, Institute of Electrical and Electronics Engineers Inc., pp. 64-65, 24th Microoptics Conference, MOC 2019, Toyama, Japan, 17/11/19. https://doi.org/10.23919/MOC46630.2019.8982786

Heterogeneous integration in silicon photonics through micro-transfer-printing. / Zhang, Jing; Muliuk, Grigorij; Goyvaerts, Jeroen et al.
MOC 2019 - 24th Microoptics Conference. Institute of Electrical and Electronics Engineers Inc., 2019. p. 64-65 8982786 (MOC 2019 - 24th Microoptics Conference).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Heterogeneous integration in silicon photonics through micro-transfer-printing

AU - Zhang, Jing

AU - Muliuk, Grigorij

AU - Goyvaerts, Jeroen

AU - Haq, Bahawal

AU - Kumari, Sulakshna

AU - Juvert, Joan

AU - De Beeck, Camiel Op

AU - Kuyken, Bart

AU - Van Campenhout, Joris

AU - Lepage, Guy

AU - Verheyen, Peter

AU - Gocalinska, Agnieszka

AU - Pelucchi, Emanuele

AU - Corbett, Brian

AU - Trindade, Antonio Jose

AU - Bower, Chris

AU - Roelkens, Gunther

PY - 2019/11

Y1 - 2019/11

N2 - Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.

AB - Micro-transfer-printing enables the intimate integration of a wide range of opto-electronic micro-components on a silicon photonics platform. This technique allows for wafer-scale integration in a massively parallel manner with high alignment accuracy, high throughput and high yield, therefore leading to a cost reduction of complex photonic integrated circuits.

UR - https://www.scopus.com/pages/publications/85081106910

U2 - 10.23919/MOC46630.2019.8982786

DO - 10.23919/MOC46630.2019.8982786

M3 - Conference proceeding

AN - SCOPUS:85081106910

T3 - MOC 2019 - 24th Microoptics Conference

SP - 64

EP - 65

BT - MOC 2019 - 24th Microoptics Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 24th Microoptics Conference, MOC 2019

Y2 - 17 November 2019 through 20 November 2019

ER -

Heterogeneous integration in silicon photonics through micro-transfer-printing

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