TY - CHAP
T1 - Heterogenous integration of telecom lasers to Si substrates by micro transfer printing
AU - Loi, Ruggero
AU - O'Callaghan, James
AU - Roycroft, Brendan
AU - Gocalinska, Agnieszka
AU - Mura, Enrica
AU - Pelucchi, Emanuele
AU - Trindade, Antonio Jose
AU - Fecioru, Alin
AU - Bower, Christopher A.
AU - Corbett, Brian
PY - 2017
Y1 - 2017
N2 - Lasers based on In(AlGaAs)P materials emitting in the optical c-band are heterogeneously integrated onto Si substrates by Micro Transfer Printing (μTP). Efficient thermal sinking allows the lasers to operate in continuous wave up to 45 °C. The reflectivity at the facets can be optimized by tuning the thickness of the passivation layer. This integration strategy can be particularly relevant for lasers being coupled to polymer or SOI waveguides for advanced photonics integrated circuits.
AB - Lasers based on In(AlGaAs)P materials emitting in the optical c-band are heterogeneously integrated onto Si substrates by Micro Transfer Printing (μTP). Efficient thermal sinking allows the lasers to operate in continuous wave up to 45 °C. The reflectivity at the facets can be optimized by tuning the thickness of the passivation layer. This integration strategy can be particularly relevant for lasers being coupled to polymer or SOI waveguides for advanced photonics integrated circuits.
UR - https://www.scopus.com/pages/publications/85032268765
M3 - Chapter
AN - SCOPUS:85032268765
T3 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
SP - 298
EP - 304
BT - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
A2 - Otto, Thomas
PB - Mesago Messe Frankfurt GmbH
T2 - International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
Y2 - 8 March 2017 through 9 March 2017
ER -