Heterostructure at CMOS source/drain: Contributor or alleviator to the high access resistance problem?

  • Hao Yu
  • , M. Schaekers
  • , E. Rosseel
  • , J. L. Everaert
  • , P. Eyben
  • , T. Chiarella
  • , C. Merckling
  • , T. K. Agarwal
  • , G. Pourtois
  • , A. Hikavyy
  • , S. Kubicek
  • , L. Witters
  • , A. Sibaja-Hernandez
  • , J. Mitard
  • , N. Waldron
  • , S. A. Chew
  • , S. Demuynck
  • , N. Horiguchi
  • , K. Barla
  • , A. V.Y. Thean
  • A. Mocuta, D. Mocuta, N. Collaert, K. De Meyer

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

This work investigates the interface resistivity of several heterostructures. Theoretical simulations suggest that, apart from the doping impact, the band offset and the difference in density of states (DOS) increase significantly the heterostructure interface resistivity. This conclusion corresponds well to our experiments that 1) high interface resistances are observed between (high-Ge content) p-SiGe/p-Si, n-InAs/n-Si, and n-InAs/n-Ge; and that 2) a TiSix/12nm Si:P/n-Ge contact with favorable band alignment between Si:P/n-Ge approaches low effective contact resistivity of 1.4×10-8 Ω cm2, close to a record-low value for n-Ge contacts.

Original languageEnglish
Title of host publication2016 IEEE International Electron Devices Meeting, IEDM 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages25.1.1-25.1.4
ISBN (Electronic)9781509039012
DOIs
Publication statusPublished - 31 Jan 2017
Externally publishedYes
Event62nd IEEE International Electron Devices Meeting, IEDM 2016 - San Francisco, United States
Duration: 3 Dec 20167 Dec 2016

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference62nd IEEE International Electron Devices Meeting, IEDM 2016
Country/TerritoryUnited States
CitySan Francisco
Period3/12/167/12/16

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