High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications

Youssef Kandeel; Liang Ye; John Flannery; Cian O. Mathuna; Ranajit Sai; Seamus O'Driscoll; Takayuki Tsuchida; Naoya Terauchi; Sumiaki Kishimoto; Toshio Hiraoka; Masanori Nagano

doi:10.1109/APEC48143.2025.10977275

High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications

Youssef Kandeel
, Liang Ye
, John Flannery
, Cian O. Mathuna
, Ranajit Sai
, Seamus O'Driscoll
, Takayuki Tsuchida
, Naoya Terauchi
, Sumiaki Kishimoto
, Toshio Hiraoka
, Masanori Nagano

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

This paper presents a substrate/PCB embeddable inductor device for Integrated Voltage Regulator (IVR) application. The inductor is fabricated with two new 100 MHz pre-release magnetic materials to suit highly integrated IVR for vertical power. The measured characteristics of the magnetic materials are presented and used in simulation models for the inductor device. The inductor is designed according to high-volume manufacturing capabilities with a target nominal height equal to the PCB core thickness of 0.3 mm, so that it can be embedded within the application PCB core or the SoC package substrate core and facilitate vertical power delivery. The fabricated inductor achieved 1.54 nH/mΩ and simulations indicate that it will achieve 97.5% inductor efficiency for V_IN = 1.8 V, V_OUT = 0.9 V, F_SW = 100 MHz and I_DC = 2 A.

Original language	English
Title of host publication	2025 IEEE Applied Power Electronics Conference and Exposition (APEC)
Pages	285-290
Number of pages	6
DOIs	https://doi.org/10.1109/APEC48143.2025.10977275
Publication status	Published - 2025
Event	14th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2025 - Atlanta, United States Duration: 16 Mar 2025 → 20 Mar 2025

Conference

Conference	14th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2025
Country/Territory	United States
City	Atlanta
Period	16/03/25 → 20/03/25

Keywords

DC-DC converter
Embedded inductor
integrated inductor
integrated voltage regulator (IVR)
power supply in package (PSiP, PwrSiP)
vertical power

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/APEC48143.2025.10977275

Cite this

@inproceedings{801434231e0e448594268468c5685353,

title = "High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications",

abstract = "This paper presents a substrate/PCB embeddable inductor device for Integrated Voltage Regulator (IVR) application. The inductor is fabricated with two new 100 MHz pre-release magnetic materials to suit highly integrated IVR for vertical power. The measured characteristics of the magnetic materials are presented and used in simulation models for the inductor device. The inductor is designed according to high-volume manufacturing capabilities with a target nominal height equal to the PCB core thickness of 0.3 mm, so that it can be embedded within the application PCB core or the SoC package substrate core and facilitate vertical power delivery. The fabricated inductor achieved 1.54 nH/mΩ and simulations indicate that it will achieve 97.5\% inductor efficiency for VIN = 1.8 V, VOUT = 0.9 V, FSW = 100 MHz and IDC = 2 A.",

keywords = "DC-DC converter, Embedded inductor, integrated inductor, integrated voltage regulator (IVR), power supply in package (PSiP, PwrSiP), vertical power",

author = "Youssef Kandeel and Liang Ye and John Flannery and Mathuna, \{Cian O.\} and Ranajit Sai and Seamus O'Driscoll and Takayuki Tsuchida and Naoya Terauchi and Sumiaki Kishimoto and Toshio Hiraoka and Masanori Nagano",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 14th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2025 ; Conference date: 16-03-2025 Through 20-03-2025",

year = "2025",

doi = "10.1109/APEC48143.2025.10977275",

language = "English",

pages = "285--290",

booktitle = "2025 IEEE Applied Power Electronics Conference and Exposition (APEC)",

}

Kandeel, Y , Ye, L, Flannery, J, Mathuna, CO , Sai, R , O'Driscoll, S, Tsuchida, T, Terauchi, N, Kishimoto, S, Hiraoka, T & Nagano, M 2025, High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications. in 2025 IEEE Applied Power Electronics Conference and Exposition (APEC). pp. 285-290, 14th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2025, Atlanta, United States, 16/03/25. https://doi.org/10.1109/APEC48143.2025.10977275

TY - GEN

T1 - High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications

AU - Kandeel, Youssef

AU - Ye, Liang

AU - Flannery, John

AU - Mathuna, Cian O.

AU - Sai, Ranajit

AU - O'Driscoll, Seamus

AU - Tsuchida, Takayuki

AU - Terauchi, Naoya

AU - Kishimoto, Sumiaki

AU - Hiraoka, Toshio

AU - Nagano, Masanori

PY - 2025

Y1 - 2025

N2 - This paper presents a substrate/PCB embeddable inductor device for Integrated Voltage Regulator (IVR) application. The inductor is fabricated with two new 100 MHz pre-release magnetic materials to suit highly integrated IVR for vertical power. The measured characteristics of the magnetic materials are presented and used in simulation models for the inductor device. The inductor is designed according to high-volume manufacturing capabilities with a target nominal height equal to the PCB core thickness of 0.3 mm, so that it can be embedded within the application PCB core or the SoC package substrate core and facilitate vertical power delivery. The fabricated inductor achieved 1.54 nH/mΩ and simulations indicate that it will achieve 97.5% inductor efficiency for VIN = 1.8 V, VOUT = 0.9 V, FSW = 100 MHz and IDC = 2 A.

AB - This paper presents a substrate/PCB embeddable inductor device for Integrated Voltage Regulator (IVR) application. The inductor is fabricated with two new 100 MHz pre-release magnetic materials to suit highly integrated IVR for vertical power. The measured characteristics of the magnetic materials are presented and used in simulation models for the inductor device. The inductor is designed according to high-volume manufacturing capabilities with a target nominal height equal to the PCB core thickness of 0.3 mm, so that it can be embedded within the application PCB core or the SoC package substrate core and facilitate vertical power delivery. The fabricated inductor achieved 1.54 nH/mΩ and simulations indicate that it will achieve 97.5% inductor efficiency for VIN = 1.8 V, VOUT = 0.9 V, FSW = 100 MHz and IDC = 2 A.

KW - DC-DC converter

KW - Embedded inductor

KW - integrated inductor

KW - integrated voltage regulator (IVR)

KW - power supply in package (PSiP, PwrSiP)

KW - vertical power

UR - https://www.scopus.com/pages/publications/105004812158

U2 - 10.1109/APEC48143.2025.10977275

DO - 10.1109/APEC48143.2025.10977275

M3 - Conference proceeding

AN - SCOPUS:105004812158

SP - 285

EP - 290

BT - 2025 IEEE Applied Power Electronics Conference and Exposition (APEC)

T2 - 14th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2025

Y2 - 16 March 2025 through 20 March 2025

ER -

High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications

Abstract

Conference

Keywords

UN SDGs

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