TY - GEN
T1 - High frequency DC-DC converter with co-packaged planar inductor and power IC
AU - Wang, Ningning
AU - Barry, John
AU - Hannon, Jason
AU - Kulkarni, Santosh
AU - Foley, Ray
AU - McCarthy, Kevin
AU - Rodgers, Kenneth
AU - Waldron, Finbarr
AU - Barry, Mark
AU - Casey, Declan
AU - Rohan, James
AU - O'Brian, Joe
AU - Hegarty, Margaret
AU - Kelleher, Ann Marie
AU - Roy, Saibal
AU - Mathuna, Cian O.
PY - 2013
Y1 - 2013
N2 - The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35μm CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor.
AB - The paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35μm CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor.
UR - https://www.scopus.com/pages/publications/84883390352
U2 - 10.1109/ECTC.2013.6575844
DO - 10.1109/ECTC.2013.6575844
M3 - Conference proceeding
AN - SCOPUS:84883390352
SN - 9781479902330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1946
EP - 1952
BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Y2 - 28 May 2013 through 31 May 2013
ER -