@inbook{265b1770d85c4ef9a7b2cebefa0e900c,
title = "High-speed Electro-absorption Modulator Assisted by Iron Doping for Micro-Transfer-Printing Integration",
abstract = "A high-speed lumped-element electro-absorption modulator designed for micro-transfer-printing onto silicon has been tested. The modulators use an iron doped layer to reduce the parasitic capacitance of the devices after transfer-printing, which is beneficial for achieving high bandwidth for heterogeneous integration applications with silicon photonics.",
keywords = "heterogeneous integration, high-speed photonics, micro transfer printing, Modulator",
author = "Shengtai Shi and Jack Mulcahy and Xing Dai and Peters, \{Frank H.\}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Silicon Photonics Conference, SiPhotonics 2024 ; Conference date: 15-04-2024 Through 18-04-2024",
year = "2024",
doi = "10.1109/SiPhotonics60897.2024.10544327",
language = "English",
series = "IEEE International Conference on Group IV Photonics GFP",
publisher = "IEEE Computer Society",
booktitle = "2024 IEEE Silicon Photonics Conference, SiPhotonics 2024 - Proceedings",
address = "United States",
}