Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device

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Abstract

The cost-effective integration of laser sources on Silicon Photonic Integrated Circuits (Si-PICs) is a key challenge to realizing the full potential of on-chip photonic solutions for telecommunication and medical applications. Hybrid integration can offer a route to high-yield solutions, using only known-good laser-chips, and simple freespace micro-optics to transport light from a discrete laser-diode to a grating-coupler on the Si-PIC. In this work, we describe a passively assembled micro-optical bench (MOB) for the hybrid integration of a 1550nm 20MHz linewidth laser-diode on a Si-PIC, developed for an on-chip interferometer based medical device. A dual-lens MOB design minimizes aberrations in the laser spot transported to the standard grating-coupler (15μm×12μm) on the Si-PIC, and facilitates the inclusion of a sub-millimeter latched-garnet optical-isolator. The 20dB suppression from the isolator helps ensure the high-frequency stability of the laser-diode, while the high thermal conductivity of the AlN submount (300W/m:°C), and the close integration of a micro-bead thermistor, ensure the stable and efficient thermo-electric cooling of the laser-diode, which helps minimise low-frequency drift during the approximately ∼ 15s of operation needed for the point-of-care measurement. The dual-lens MOB is compatible with cost-effective passively-aligned mass-production, and can be optimised for alternative PIC-based applications.

Original languageEnglish
Title of host publicationOptical Interconnects XVII
EditorsRay T. Chen, Henning Schroder
PublisherSPIE
ISBN (Electronic)9781510606593
DOIs
Publication statusPublished - 2017
EventOptical Interconnects XVII - San Francisco, United States
Duration: 30 Jan 20171 Feb 2017

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10109
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceOptical Interconnects XVII
Country/TerritoryUnited States
CitySan Francisco
Period30/01/171/02/17

Keywords

  • Hybrid integration
  • Laser
  • Micro-optical bench
  • Optics
  • Photonic packaging
  • Photonics

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