Abstract
This paper presents the experiments we performed for hybrid integration of LED's with silicon photonic integration circuits. LED's were face down mounted in a silicon cavity. The edge-emitted light is coupled in SiON waveguides. The silicon cavity was obtained by anisotropic etching of the silicon substrate. The integration of all the components on one chip increases the sensor reliability and reduces the size, weight and cost.
| Original language | English |
|---|---|
| Pages | 523-526 |
| Number of pages | 4 |
| Publication status | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 International Semiconductor Conference, CAS'98. Part 2 (of 2) - Sinaia, Romania Duration: 6 Oct 1998 → 10 Oct 1998 |
Conference
| Conference | Proceedings of the 1998 International Semiconductor Conference, CAS'98. Part 2 (of 2) |
|---|---|
| City | Sinaia, Romania |
| Period | 6/10/98 → 10/10/98 |
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