Abstract
A technology for hybridly integrating a discrete edge-emitting laser with a submicrometer silicon-on-insulator waveguide is presented. This technology is based on a ceramic microoptical bench which is compatible with high-speed electrical direct modulation. The use of passive-and self-alignment techniques is demonstrated to be suitable for assembling the microoptical bench with the laser die and optical components. The placement tolerance of less than 1 dB loss over a 4 \mu m range during the final integration with the waveguide is suited to a passive alignment process as well, thus permitting wafer-scale assembly and mass manufacture. The integration of both a Fabry-Pérot laser and a two-section electrically tunable multiwavelength laser was performed. An excess insertion loss of only 3.36 dB was measured, which combined with state-of-the-art grating couplers promises a coupling efficiency from laser to waveguide of better than 40%.
| Original language | English |
|---|---|
| Article number | 6575098 |
| Pages (from-to) | 3934-3942 |
| Number of pages | 9 |
| Journal | Journal of Lightwave Technology |
| Volume | 31 |
| Issue number | 24 |
| DOIs | |
| Publication status | Published - 15 Dec 2013 |
Keywords
- Microoptics
- optical interconnections
- optical waveguides
- photonics
- silicon-on-insulator (SOI) technology