@inbook{32a8117587be4ec2bfdb09c0c6f555da,
title = "Hybrid integration of VCSELs onto a silicon photonic platform for biosensing application",
abstract = "This paper presents a technology of hybrid integration vertical cavity surface emitting lasers (VCSELs) directly on silicon photonics chip. By controlling the reflow of the solder balls used for electrical and mechanical bonding, the VCSELs were bonded at 10 degree to achieve the optimum angle-of-incidence to the planar grating coupler through vision based flip-chip techniques. The 1 dB discrepancy between optical loss values of flip-chip passive assembly and active alignment confirmed that the general purpose of the flip-chip design concept is achieved. This hybrid approach of integrating a miniaturized light source on chip opens the possibly of highly compact sensor system, which enable future portable and wearable diagnostics devices.",
keywords = "Diagnostics, Flip-chip, Photonics integrated circuits, Silicon photonics, VCSEL, Wearable technology",
author = "Huihui Lu and Lee, \{Jun Su\} and Yan Zhao and Paolo Cardile and Aidan Daly and Lee Carroll and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2017 SPIE.; Optical Diagnostics and Sensing XVII: Toward Point-of-Care Diagnostics ; Conference date: 30-01-2017 Through 31-01-2017",
year = "2017",
doi = "10.1117/12.2250859",
language = "English",
series = "Progress in Biomedical Optics and Imaging - Proceedings of SPIE",
publisher = "SPIE",
editor = "Cote, \{Gerard L.\}",
booktitle = "Optical Diagnostics and Sensing XVII",
address = "United States",
}