III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Jing Zhang; Grigorij Muliuk; Joan Juvert; Sulakshna Kumari; Jeroen Goyvaerts; Bahawal Haq; Camiel Op De Beeck; Bart Kuyken; Geert Morthier; Dries Van Thourhout; Roel Baets; Guy Lepage; Peter Verheyen; Joris Van Campenhout; Agnieszka Gocalinska; James O'Callaghan; Emanuele Pelucchi; Kevin Thomas; Brian Corbett; António José Trindade; Gunther Roelkens

doi:10.1063/1.5120004

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Jing Zhang
, Grigorij Muliuk
, Joan Juvert
, Sulakshna Kumari
, Jeroen Goyvaerts
, Bahawal Haq
, Camiel Op De Beeck
, Bart Kuyken
, Geert Morthier
, Dries Van Thourhout
, Roel Baets
, Guy Lepage
, Peter Verheyen
, Joris Van Campenhout
, Agnieszka Gocalinska
, James O'Callaghan
, Emanuele Pelucchi
, Kevin Thomas
, Brian Corbett
, António José Trindade

Gunther Roelkens

Ghent University
Interuniversitair Micro-Elektronica Centrum
University College Cork
X-Celeprint Ireland

Research output: Contribution to journal › Article › peer-review

Abstract

Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

Original language	English
Article number	110803
Journal	APL Photonics
Volume	4
Issue number	11
DOIs	https://doi.org/10.1063/1.5120004
Publication status	Published - 1 Nov 2019

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Zhang, J., Muliuk, G., Juvert, J., Kumari, S., Goyvaerts, J., Haq, B., Op De Beeck, C., Kuyken, B., Morthier, G., Van Thourhout, D., Baets, R., Lepage, G., Verheyen, P., Van Campenhout, J., Gocalinska, A., O'Callaghan, J., Pelucchi, E., Thomas, K., Corbett, B., ... Roelkens, G. (2019). III-V-on-Si photonic integrated circuits realized using micro-transfer-printing. APL Photonics, 4(11), Article 110803. https://doi.org/10.1063/1.5120004

@article{d3df0feaaedb40af88b08e34f8fcd987,

title = "III-V-on-Si photonic integrated circuits realized using micro-transfer-printing",

abstract = "Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.",

author = "Jing Zhang and Grigorij Muliuk and Joan Juvert and Sulakshna Kumari and Jeroen Goyvaerts and Bahawal Haq and \{Op De Beeck\}, Camiel and Bart Kuyken and Geert Morthier and \{Van Thourhout\}, Dries and Roel Baets and Guy Lepage and Peter Verheyen and \{Van Campenhout\}, Joris and Agnieszka Gocalinska and James O'Callaghan and Emanuele Pelucchi and Kevin Thomas and Brian Corbett and Trindade, \{Ant{\'o}nio Jos{\'e}\} and Gunther Roelkens",

note = "Publisher Copyright: {\textcopyright} 2019 Author(s).",

year = "2019",

month = nov,

day = "1",

doi = "10.1063/1.5120004",

language = "English",

volume = "4",

journal = "APL Photonics",

issn = "2378-0967",

publisher = "American Institute of Physics",

number = "11",

}

Zhang, J, Muliuk, G, Juvert, J, Kumari, S, Goyvaerts, J, Haq, B, Op De Beeck, C, Kuyken, B, Morthier, G, Van Thourhout, D, Baets, R, Lepage, G, Verheyen, P, Van Campenhout, J, Gocalinska, A, O'Callaghan, J , Pelucchi, E, Thomas, K, Corbett, B, Trindade, AJ & Roelkens, G 2019, 'III-V-on-Si photonic integrated circuits realized using micro-transfer-printing', APL Photonics, vol. 4, no. 11, 110803. https://doi.org/10.1063/1.5120004

TY - JOUR

T1 - III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

AU - Zhang, Jing

AU - Muliuk, Grigorij

AU - Juvert, Joan

AU - Kumari, Sulakshna

AU - Goyvaerts, Jeroen

AU - Haq, Bahawal

AU - Op De Beeck, Camiel

AU - Kuyken, Bart

AU - Morthier, Geert

AU - Van Thourhout, Dries

AU - Baets, Roel

AU - Lepage, Guy

AU - Verheyen, Peter

AU - Van Campenhout, Joris

AU - Gocalinska, Agnieszka

AU - O'Callaghan, James

AU - Pelucchi, Emanuele

AU - Thomas, Kevin

AU - Corbett, Brian

AU - Trindade, António José

AU - Roelkens, Gunther

PY - 2019/11/1

Y1 - 2019/11/1

N2 - Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

AB - Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

UR - https://www.scopus.com/pages/publications/85074700030

U2 - 10.1063/1.5120004

DO - 10.1063/1.5120004

M3 - Article

AN - SCOPUS:85074700030

SN - 2378-0967

VL - 4

JO - APL Photonics

JF - APL Photonics

IS - 11

M1 - 110803

ER -

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

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