TY - JOUR
T1 - III-V-on-Silicon Integration
T2 - From Hybrid Devices to Heterogeneous Photonic Integrated Circuits
AU - Ramirez, Joan Manel
AU - Elfaiki, Hajar
AU - Verolet, Théo
AU - Besancon, Claire
AU - Gallet, Antonin
AU - Néel, Delphine
AU - Hassan, Karim
AU - Olivier, Ségolène
AU - Jany, Christophe
AU - Malhouitre, Stéphane
AU - Gradkowski, Kamil
AU - Morrissey, Padraic E.
AU - O'Brien, Peter
AU - Caillaud, Christophe
AU - Vaissière, Nicolas
AU - Decobert, Jean
AU - Lei, Shenghui
AU - Enright, Ryan
AU - Shen, Alexandre
AU - Achouche, Mohand
N1 - Publisher Copyright:
© 1995-2012 IEEE.
PY - 2020/3/1
Y1 - 2020/3/1
N2 - Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting the groundwork for the implementation of complex on-chip optical systems that go beyond single device performance. Recent advances on the field are expected to impact the next generation of optical communications to attain low power, high efficiency and portable solutions. To accomplish this aim, intense research on hybrid lasers, modulators and photodetectors is being done to implement optical modules and photonic integrated networks with specifications that match the market demands. Similarly, important advances on packaging and thermal management of hybrid photonic integrated circuits (PICs) are currently in progress. In this paper, we report our latest results on hybrid III-V on Si transmitters, receivers and packaged optical modules for high-speed optical communications. In addition, a review of recent advances in this field will be provided for benchmarking purposes.
AB - Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting the groundwork for the implementation of complex on-chip optical systems that go beyond single device performance. Recent advances on the field are expected to impact the next generation of optical communications to attain low power, high efficiency and portable solutions. To accomplish this aim, intense research on hybrid lasers, modulators and photodetectors is being done to implement optical modules and photonic integrated networks with specifications that match the market demands. Similarly, important advances on packaging and thermal management of hybrid photonic integrated circuits (PICs) are currently in progress. In this paper, we report our latest results on hybrid III-V on Si transmitters, receivers and packaged optical modules for high-speed optical communications. In addition, a review of recent advances in this field will be provided for benchmarking purposes.
KW - hybrid integrated lasers
KW - III-V on SOI photonic integrated circuits
KW - on-chip silicon transmitters and receivers
KW - silicon photonics packaging
KW - thermal management
UR - https://www.scopus.com/pages/publications/85075998256
U2 - 10.1109/JSTQE.2019.2939503
DO - 10.1109/JSTQE.2019.2939503
M3 - Article
AN - SCOPUS:85075998256
SN - 1077-260X
VL - 26
JO - IEEE Journal of Selected Topics in Quantum Electronics
JF - IEEE Journal of Selected Topics in Quantum Electronics
IS - 2
M1 - 8823948
ER -