TY - GEN
T1 - III-V-on-silicon widely tunable laser realized using micro-tranfer-printing
AU - Zhang, Jing
AU - Gocalinkska, Agnieszka
AU - Pelucchi, Emanuele
AU - van Campenhout, Joris
AU - Lepage, Guy
AU - Verheyen, Peter
AU - Corbett, Brian
AU - Roelkens, Gunther
N1 - Publisher Copyright:
© 2019 Institution of Engineering and Technology. All rights reserved.
PY - 2019
Y1 - 2019
N2 - We present a C-band widely-tunable III-V-on-silicon laser (50 nm tuning, 5.2 dBm maximum power, 300 kHz minimum linewidth) realized through a micro-transfer-printing approach, in which III-V SOAs are pre-fabricated on a III-V substrate transferred using an elastomeric stamp to the silicon photonic circuit defining the laser cavity.
AB - We present a C-band widely-tunable III-V-on-silicon laser (50 nm tuning, 5.2 dBm maximum power, 300 kHz minimum linewidth) realized through a micro-transfer-printing approach, in which III-V SOAs are pre-fabricated on a III-V substrate transferred using an elastomeric stamp to the silicon photonic circuit defining the laser cavity.
KW - III-V semiconductor materials
KW - Semiconductor lasers
KW - Silicon Photonics
UR - https://www.scopus.com/pages/publications/85086904014
M3 - Conference proceeding
AN - SCOPUS:85086904014
T3 - IET Conference Publications
BT - IET Conference Publications
PB - Institution of Engineering and Technology
T2 - 45th European Conference on Optical Communication, ECOC 2019
Y2 - 22 September 2019 through 26 September 2019
ER -