III-V/Si PICs based on micro-transfer-printing

Gunther Roelkens; Jing Zhang; Grigorij Muliuk; Jeroen Goyvaerts; Bahawal Haq; Camiel Op de Beeck; Alexandros Liles; Zheng Wang; Sören Dhoore; Sulakshna Kumari; Joan Juvert; Joris van Campenhout; Bart Kuyken; Dries van Thourhout; Brian Corbett; Antonio Jose Trindade; Chris Bower; Roel Baets

III-V/Si PICs based on micro-transfer-printing

Gunther Roelkens
, Jing Zhang
, Grigorij Muliuk
, Jeroen Goyvaerts
, Bahawal Haq
, Camiel Op de Beeck
, Alexandros Liles
, Zheng Wang
, Sören Dhoore
, Sulakshna Kumari
, Joan Juvert
, Joris van Campenhout
, Bart Kuyken
, Dries van Thourhout
, Brian Corbett
, Antonio Jose Trindade
, Chris Bower
, Roel Baets

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

Abstract

III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.

Original language	English
Title of host publication	Optical Fiber Communication Conference, OFC 2019
Publisher	Optica Publishing Group (formerly OSA)
ISBN (Print)	9781943580538
Publication status	Published - 2019
Event	Optical Fiber Communication Conference, OFC 2019 - San Diego, United States Duration: 3 Mar 2019 → 7 Mar 2019

Publication series

Name	Optics InfoBase Conference Papers
Volume	Part F160-OFC 2019
ISSN (Electronic)	2162-2701

Conference

Conference	Optical Fiber Communication Conference, OFC 2019
Country/Territory	United States
City	San Diego
Period	3/03/19 → 7/03/19

Cite this

Roelkens, G., Zhang, J., Muliuk, G., Goyvaerts, J., Haq, B., de Beeck, C. O., Liles, A., Wang, Z., Dhoore, S., Kumari, S., Juvert, J., van Campenhout, J., Kuyken, B., van Thourhout, D., Corbett, B., Trindade, A. J., Bower, C., & Baets, R. (2019). III-V/Si PICs based on micro-transfer-printing. In Optical Fiber Communication Conference, OFC 2019 Article OFC-2019-W4E.6 (Optics InfoBase Conference Papers; Vol. Part F160-OFC 2019). Optica Publishing Group (formerly OSA).

@inbook{d50c44bfb7af4f89ac721e65390928db,

title = "III-V/Si PICs based on micro-transfer-printing",

abstract = "III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.",

author = "Gunther Roelkens and Jing Zhang and Grigorij Muliuk and Jeroen Goyvaerts and Bahawal Haq and \{de Beeck\}, \{Camiel Op\} and Alexandros Liles and Zheng Wang and S{\"o}ren Dhoore and Sulakshna Kumari and Joan Juvert and \{van Campenhout\}, Joris and Bart Kuyken and \{van Thourhout\}, Dries and Brian Corbett and Trindade, \{Antonio Jose\} and Chris Bower and Roel Baets",

note = "Publisher Copyright: {\textcopyright} OSA 2019 {\textcopyright} 2019 The Author(s); Optical Fiber Communication Conference, OFC 2019 ; Conference date: 03-03-2019 Through 07-03-2019",

year = "2019",

language = "English",

isbn = "9781943580538",

series = "Optics InfoBase Conference Papers",

publisher = "Optica Publishing Group (formerly OSA)",

booktitle = "Optical Fiber Communication Conference, OFC 2019",

address = "United States",

}

Roelkens, G, Zhang, J, Muliuk, G, Goyvaerts, J, Haq, B, de Beeck, CO, Liles, A, Wang, Z, Dhoore, S, Kumari, S, Juvert, J, van Campenhout, J, Kuyken, B, van Thourhout, D, Corbett, B, Trindade, AJ, Bower, C & Baets, R 2019, III-V/Si PICs based on micro-transfer-printing. in Optical Fiber Communication Conference, OFC 2019., OFC-2019-W4E.6, Optics InfoBase Conference Papers, vol. Part F160-OFC 2019, Optica Publishing Group (formerly OSA), Optical Fiber Communication Conference, OFC 2019, San Diego, United States, 3/03/19.

TY - CHAP

T1 - III-V/Si PICs based on micro-transfer-printing

AU - Roelkens, Gunther

AU - Zhang, Jing

AU - Muliuk, Grigorij

AU - Goyvaerts, Jeroen

AU - Haq, Bahawal

AU - de Beeck, Camiel Op

AU - Liles, Alexandros

AU - Wang, Zheng

AU - Dhoore, Sören

AU - Kumari, Sulakshna

AU - Juvert, Joan

AU - van Campenhout, Joris

AU - Kuyken, Bart

AU - van Thourhout, Dries

AU - Corbett, Brian

AU - Trindade, Antonio Jose

AU - Bower, Chris

AU - Baets, Roel

PY - 2019

Y1 - 2019

N2 - III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.

AB - III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.

UR - https://www.scopus.com/pages/publications/85085549660

M3 - Chapter

AN - SCOPUS:85085549660

SN - 9781943580538

T3 - Optics InfoBase Conference Papers

BT - Optical Fiber Communication Conference, OFC 2019

PB - Optica Publishing Group (formerly OSA)

T2 - Optical Fiber Communication Conference, OFC 2019

Y2 - 3 March 2019 through 7 March 2019

ER -

III-V/Si PICs based on micro-transfer-printing

Abstract

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