III-V/silicon photonic integrated circuits for communication and sensing applications

Gunther Roelkens; Shahram Keyvaninia; Stevan Stankovic; Yannick De Koninck; Martijn Tassaert; Pauline Mechet; Thijs Spuesens; N. Hattasan; A. Gassenq; M. Muneeb; E. Ryckeboer; Samir Ghosh; D. Van Thourhout; R. Baets

doi:10.1117/12.2001304

III-V/silicon photonic integrated circuits for communication and sensing applications

Gunther Roelkens
, Shahram Keyvaninia
, Stevan Stankovic
, Yannick De Koninck
, Martijn Tassaert
, Pauline Mechet
, Thijs Spuesens
, N. Hattasan
, A. Gassenq
, M. Muneeb
, E. Ryckeboer
, Samir Ghosh
, D. Van Thourhout
, R. Baets

Ghent University

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

Abstract

In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.

Original language	English
Title of host publication	Integrated Optics
Subtitle of host publication	Devices, Materials, and Technologies XVII
DOIs	https://doi.org/10.1117/12.2001304
Publication status	Published - 2013
Externally published	Yes
Event	Integrated Optics: Devices, Materials, and Technologies XVII - San Francisco, CA, United States Duration: 5 Feb 2013 → 7 Feb 2013

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	8627
ISSN (Print)	0277-786X

Conference

Conference	Integrated Optics: Devices, Materials, and Technologies XVII
Country/Territory	United States
City	San Francisco, CA
Period	5/02/13 → 7/02/13

Keywords

Heterogeneous integration
Silicon-on-insulator

Access to Document

10.1117/12.2001304

Cite this

Roelkens, G., Keyvaninia, S., Stankovic, S., De Koninck, Y., Tassaert, M., Mechet, P., Spuesens, T., Hattasan, N., Gassenq, A., Muneeb, M., Ryckeboer, E., Ghosh, S., Van Thourhout, D., & Baets, R. (2013). III-V/silicon photonic integrated circuits for communication and sensing applications. In Integrated Optics: Devices, Materials, and Technologies XVII Article 862707 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 8627). https://doi.org/10.1117/12.2001304

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title = "III-V/silicon photonic integrated circuits for communication and sensing applications",

abstract = "In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.",

keywords = "Heterogeneous integration, Silicon-on-insulator",

author = "Gunther Roelkens and Shahram Keyvaninia and Stevan Stankovic and \{De Koninck\}, Yannick and Martijn Tassaert and Pauline Mechet and Thijs Spuesens and N. Hattasan and A. Gassenq and M. Muneeb and E. Ryckeboer and Samir Ghosh and \{Van Thourhout\}, D. and R. Baets",

year = "2013",

doi = "10.1117/12.2001304",

language = "English",

isbn = "9780819493965",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

booktitle = "Integrated Optics",

note = "Integrated Optics: Devices, Materials, and Technologies XVII ; Conference date: 05-02-2013 Through 07-02-2013",

}

Roelkens, G, Keyvaninia, S, Stankovic, S, De Koninck, Y, Tassaert, M, Mechet, P, Spuesens, T, Hattasan, N, Gassenq, A, Muneeb, M, Ryckeboer, E, Ghosh, S, Van Thourhout, D & Baets, R 2013, III-V/silicon photonic integrated circuits for communication and sensing applications. in Integrated Optics: Devices, Materials, and Technologies XVII., 862707, Proceedings of SPIE - The International Society for Optical Engineering, vol. 8627, Integrated Optics: Devices, Materials, and Technologies XVII, San Francisco, CA, United States, 5/02/13. https://doi.org/10.1117/12.2001304

III-V/silicon photonic integrated circuits for communication and sensing applications. / Roelkens, Gunther; Keyvaninia, Shahram; Stankovic, Stevan et al.
Integrated Optics: Devices, Materials, and Technologies XVII. 2013. 862707 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 8627).

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

TY - CHAP

T1 - III-V/silicon photonic integrated circuits for communication and sensing applications

AU - Roelkens, Gunther

AU - Keyvaninia, Shahram

AU - Stankovic, Stevan

AU - De Koninck, Yannick

AU - Tassaert, Martijn

AU - Mechet, Pauline

AU - Spuesens, Thijs

AU - Hattasan, N.

AU - Gassenq, A.

AU - Muneeb, M.

AU - Ryckeboer, E.

AU - Ghosh, Samir

AU - Van Thourhout, D.

AU - Baets, R.

PY - 2013

Y1 - 2013

N2 - In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.

AB - In this paper we review our work in the field of heterogeneous integration of III-V semiconductors and non-reciprocal optical materials on a silicon waveguide circuit. We elaborate on the heterogeneous integration technology based on adhesive DVS-BCB die-to-wafer bonding and discuss several device demonstrations. The presented devices are envisioned to be used in photonic integrated circuits for communication applications (telecommunications and optical interconnects) as well as in spectroscopic sensing systems operating in the short-wave infrared wavelength range.

KW - Heterogeneous integration

KW - Silicon-on-insulator

UR - https://www.scopus.com/pages/publications/84878200764

U2 - 10.1117/12.2001304

DO - 10.1117/12.2001304

M3 - Chapter

AN - SCOPUS:84878200764

SN - 9780819493965

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Integrated Optics

T2 - Integrated Optics: Devices, Materials, and Technologies XVII

Y2 - 5 February 2013 through 7 February 2013

ER -

III-V/silicon photonic integrated circuits for communication and sensing applications

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Keywords

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