TY - GEN
T1 - IlI-V/Si PICs Based on Micro-Transfer-Printing
AU - Roelkens, Gunther
AU - Zhang, Jing
AU - Muliuk, Grigorij
AU - Goyvaerts, Jeroen
AU - Haq, Bahawal
AU - De Beeck, Camiel Op
AU - Liles, Alexandros
AU - Wang, Zheng
AU - Dhoore, Soren
AU - Kumari, Sulakshna
AU - Juvert, Joan
AU - Van Campenhout, Joris
AU - Kuyken, Bart
AU - Van Thourhout, Dries
AU - Corbett, Brian
AU - Trindade, Antonio Jose
AU - Bower, Chris
AU - Baets, Roel
N1 - Publisher Copyright:
© 2019 OSA.
PY - 2019/4/22
Y1 - 2019/4/22
N2 - III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.
AB - III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.
UR - https://www.scopus.com/pages/publications/85065485758
M3 - Conference proceeding
AN - SCOPUS:85065485758
T3 - 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings
BT - 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019
Y2 - 3 March 2019 through 7 March 2019
ER -