Impact study of substrate materials on wireless sensor node RF performance

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper, the effect of the substrate on wireless sensor network (WSN) node's RF performance is studied experimentally by using different substrate materials with different thickness. A six-layer FR4 substrate PCB WSN node is fabricated and compared with the original two-layer FR4 PCB node to show the impact of substrate material thickness. Also different substrate dielectric constants' impacts are studied by the same method. All these demonstrators are modeling by RF circuit analysis method and simulated in the Ansoft Designer software. Simulation results match the experimental measurement. An optimization method based on simulation for WSN node design with different substrate is presented. This analysis, modeling, simulation and optimization procedure can be carried out on some novel substrate materials such as LTCC and LCP.

Original languageEnglish
Title of host publicationOptoelectronic Materials
EditorsYuan Ming Huang
PublisherTrans Tech Publications Ltd
Pages455-461
Number of pages7
ISBN (Print)0878492119, 9780878492114
DOIs
Publication statusPublished - 2011

Publication series

NameMaterials Science Forum
Volume663-665
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Keywords

  • Optimization
  • Return loss
  • RF circuit modeling
  • Substrate impact

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