Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's

Gerard Kelly; Colin Lyden; William Lawton; John Barrett; Alireza Saboui; Heinz Pape; Henk J.B. Peters

doi:10.1109/96.496032

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's

Gerard Kelly
, Colin Lyden
, William Lawton
, John Barrett
, Alireza Saboui
, Heinz Pape
, Henk J.B. Peters

Tyndall IPES (Energy4IOT)

Research output: Contribution to journal › Article › peer-review

Abstract

This paper addresses the use of finite element (FE) techniques to predict residual warpage in plastic quad flat packs (PQFP's) after encapsulation. Experimental measurements of package warpage are used to validate FE models of the packages. Failure to incorporate mold compound chemical shrinkage into the FE analysis leads to erroneous predictions of package warpage. The warpage sensitivity of different packages to changes in downset is presented. The validated FE package models predict stress levels in packages which are 70% greater than those with temperature coefficient of expansion (TCE) shrinkage alone and questions the accuracy of previous simulations which do not include molding compound chemical shrinkage.

Original language	English
Pages (from-to)	296-299
Number of pages	4
Journal	IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Volume	19
Issue number	2
DOIs	https://doi.org/10.1109/96.496032
Publication status	Published - May 1996

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abstract = "This paper addresses the use of finite element (FE) techniques to predict residual warpage in plastic quad flat packs (PQFP's) after encapsulation. Experimental measurements of package warpage are used to validate FE models of the packages. Failure to incorporate mold compound chemical shrinkage into the FE analysis leads to erroneous predictions of package warpage. The warpage sensitivity of different packages to changes in downset is presented. The validated FE package models predict stress levels in packages which are 70\% greater than those with temperature coefficient of expansion (TCE) shrinkage alone and questions the accuracy of previous simulations which do not include molding compound chemical shrinkage.",

author = "Gerard Kelly and Colin Lyden and William Lawton and John Barrett and Alireza Saboui and Heinz Pape and Peters, \{Henk J.B.\}",

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AU - Lawton, William

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AU - Saboui, Alireza

AU - Pape, Heinz

AU - Peters, Henk J.B.

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AB - This paper addresses the use of finite element (FE) techniques to predict residual warpage in plastic quad flat packs (PQFP's) after encapsulation. Experimental measurements of package warpage are used to validate FE models of the packages. Failure to incorporate mold compound chemical shrinkage into the FE analysis leads to erroneous predictions of package warpage. The warpage sensitivity of different packages to changes in downset is presented. The validated FE package models predict stress levels in packages which are 70% greater than those with temperature coefficient of expansion (TCE) shrinkage alone and questions the accuracy of previous simulations which do not include molding compound chemical shrinkage.

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ER -

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's

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