Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's
- Gerard Kelly
- , Colin Lyden
- , William Lawton
- , John Barrett
- , Alireza Saboui
- , Heinz Pape
- , Henk J.B. Peters
- IEEE
- STMicroelectronics
- Dept. HL BR MT A3
- Fico Molding Systems
Research output: Contribution to journal › Article › peer-review