Improved fin width scaling in fully-depleted FinFETs by source-drain implant optimization

  • R. Duffy
  • , M. J.H. Van Dal
  • , B. J. Pawlak
  • , N. Collaert
  • , L. Witters
  • , R. Rooyackers
  • , M. Kaiser
  • , R. G.R. Weemaes
  • , M. Jurczak
  • , R. J.P. Lander

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

Scaling the fin width in fully-depleted FinFETs can improve short channel effect control, but may be accompanied by a on-state drive current degradation. Ion implantation is a leading candidate as the means to introduce dopants into the silicon, but is often accompanied by amorphization when highly doped source-drain regions are formed. Thin-body silicon recrystallization after amorphization is not as straight-forward as bulk silicon. Crystalline integrity is worse as the fin width is scaled, thereby reducing dopant activation and increasing access resistance. In this work we demonstrate that non-amorphizing implant approaches can overcome drive degradation down to 10 nm wide fins in pMOS FinFETs.

Original languageEnglish
Title of host publicationESSDERC 2008 - Proceedings of the 38th European Solid-State Device Research Conference
PublisherIEEE Computer Society
Pages334-337
Number of pages4
ISBN (Print)9781424423644
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventESSDERC 2008 - 38th European Solid-State Device Research Conference - Edinburgh, Scotland, United Kingdom
Duration: 15 Sep 200819 Sep 2008

Publication series

NameESSDERC 2008 - Proceedings of the 38th European Solid-State Device Research Conference

Conference

ConferenceESSDERC 2008 - 38th European Solid-State Device Research Conference
Country/TerritoryUnited Kingdom
CityEdinburgh, Scotland
Period15/09/0819/09/08

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