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Improved reliability of Al 2O 3/InGaAs/InP MOS structures through in-situ forming gas annealing

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Abstract

In this paper we report on the leakage currents and time dependent dielectric breakdown characteristics of Al 2O 3/InGaAs/InP MOS structures where the Al 2O 3 dielectric is formed by atomic layer deposition (ALD) and the structures were annealed in-situ in the ALD reactor after Al 2O 3 growth. The effect of an in-situ forming gas (H 2/N 2) anneals and an in-situ H2/Ar plasma anneals was examined. The in-situ forming gas anneal was found to improve the time dependent dielectric breakdown characteristics without significant degradation of the gate stack capacitance. We also show that the H 2/Ar plasma treatment results in a marked reliability improvement but also causes a significant degradation of the gate stack capacitance which is confirmed by TEM to be a result on an increased physical thickness of the gate dielectric.

Original languageEnglish
Title of host publication2012 IEEE International Reliability Physics Symposium, IRPS 2012
PagesPI.1.1-PI.1.5
DOIs
Publication statusPublished - 2012
Event2012 IEEE International Reliability Physics Symposium, IRPS 2012 - Anaheim, CA, United States
Duration: 15 Apr 201219 Apr 2012

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Conference

Conference2012 IEEE International Reliability Physics Symposium, IRPS 2012
Country/TerritoryUnited States
CityAnaheim, CA
Period15/04/1219/04/12

Keywords

  • Al O
  • CMOS reliability
  • Forming Gas Anneal
  • InGaAs
  • stress induced leakage current
  • Time dependent dielectric breakdown

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