Improved shielding performance using high permeability electroplated thin films in printed circuit boards

Maeve Duffy; Santosh Kulkarni; Saibal Roy

doi:10.1109/TMAG.2011.2153191

Improved shielding performance using high permeability electroplated thin films in printed circuit boards

Maeve Duffy
, Santosh Kulkarni
, Saibal Roy

Research output: Contribution to journal › Article › peer-review

Abstract

The application of electroplated magnetic materials for improved shielding of inductive coil structures produced using printed circuit board (PCB) technology is demonstrated. In this way, the range of shielding materials available for use in PCB as a replacement for ferrite is increased, so that a wider range of applications can be addressed and practical issues associated with the need for attachment and brittleness of ferrite are eliminated. A comparison of shielding performance of four different soft magnetic alloys is presented. The performance of different thicknesses and permeability of electroplated materials is compared in terms of coil inductance and shielding effectiveness (SE). Simulations and measurements show that the proposed alloy materials can provide inductance enhancement of inductive coils in PCB by a factor of over 1.4, while matching the SE levels of ferrite.

Original language	English
Article number	6027742
Pages (from-to)	4282-4285
Number of pages	4
Journal	IEEE Transactions on Magnetics
Volume	47
Issue number	10
DOIs	https://doi.org/10.1109/TMAG.2011.2153191
Publication status	Published - Oct 2011

Keywords

Electrodeposited magnetic alloys
high permeability soft alloys
magnetic shielding
shielding effectiveness (SE)

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10.1109/TMAG.2011.2153191

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abstract = "The application of electroplated magnetic materials for improved shielding of inductive coil structures produced using printed circuit board (PCB) technology is demonstrated. In this way, the range of shielding materials available for use in PCB as a replacement for ferrite is increased, so that a wider range of applications can be addressed and practical issues associated with the need for attachment and brittleness of ferrite are eliminated. A comparison of shielding performance of four different soft magnetic alloys is presented. The performance of different thicknesses and permeability of electroplated materials is compared in terms of coil inductance and shielding effectiveness (SE). Simulations and measurements show that the proposed alloy materials can provide inductance enhancement of inductive coils in PCB by a factor of over 1.4, while matching the SE levels of ferrite.",

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AU - Roy, Saibal

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N2 - The application of electroplated magnetic materials for improved shielding of inductive coil structures produced using printed circuit board (PCB) technology is demonstrated. In this way, the range of shielding materials available for use in PCB as a replacement for ferrite is increased, so that a wider range of applications can be addressed and practical issues associated with the need for attachment and brittleness of ferrite are eliminated. A comparison of shielding performance of four different soft magnetic alloys is presented. The performance of different thicknesses and permeability of electroplated materials is compared in terms of coil inductance and shielding effectiveness (SE). Simulations and measurements show that the proposed alloy materials can provide inductance enhancement of inductive coils in PCB by a factor of over 1.4, while matching the SE levels of ferrite.

AB - The application of electroplated magnetic materials for improved shielding of inductive coil structures produced using printed circuit board (PCB) technology is demonstrated. In this way, the range of shielding materials available for use in PCB as a replacement for ferrite is increased, so that a wider range of applications can be addressed and practical issues associated with the need for attachment and brittleness of ferrite are eliminated. A comparison of shielding performance of four different soft magnetic alloys is presented. The performance of different thicknesses and permeability of electroplated materials is compared in terms of coil inductance and shielding effectiveness (SE). Simulations and measurements show that the proposed alloy materials can provide inductance enhancement of inductive coils in PCB by a factor of over 1.4, while matching the SE levels of ferrite.

KW - Electrodeposited magnetic alloys

KW - high permeability soft alloys

KW - magnetic shielding

KW - shielding effectiveness (SE)

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Improved shielding performance using high permeability electroplated thin films in printed circuit boards

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