Impurity solubility and redistribution due to recrystallization of preamorphized silicon

  • Ray Duffy
  • , Vincent Venezia
  • , Marco Hopstaken
  • , Geert Maas
  • , Thuy Dao
  • , Yde Tamminga
  • , Fred Roozeboom
  • , Karel Van Der Tak

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

The use of silicon substrate preamorphization in ultrashallow junction formation has increased in recent years. The reduction of channeling during impurity implantation, coupled with higher-than-equilibrium metastable solubility levels, produces scaled junctions with low resistances. However, a number of physical phenomena arise that must be considered for proper impurity profile and device optimization. With respect to impurity solubility advanced annealing techniques such as solid-phase-epitaxial-regrowth (SPER), flash, and laser annealing, can place impurity atoms on substitutional sites in the silicon lattice to extremely high concentrations when combined with preamorphization. In this context there is a relationship between the equilibrium distribution coefficient and metastable solubility. The long-established equilibrium distribution coefficient of an impurity, extracted in the liquid to solid phase transformation, can make a prediction of metastable solubility after transformation of amorphous silicon into crystalline silicon during SPER, flash, and laser annealing. With respect to impurity redistribution the significant effects can be split into 3 categories, namely before, during, and after recrystallization. Before recrystallization impurity diffusion in the amorphous region may occur. Boron is particularly susceptible to this effect, which is very significant for the formation of p-type junctions. During recrystallization many impurities move ahead of the amorphous-crystalline (a/c) interface and relocate closer to the surface. In general redistribution is more likely at high impurity concentrations. For low-temperature SPER there is a direct correlation between the magnitude of this redistribution effect and the impurity metastable solubility. After recrystallization, with SPER, flash, and laser annealing commonly leaving residual damage in the silicon substrate, interstitial- diffusers are especially vulnerable to preferential diffusion toward the surface, where impurity atoms may be trapped, ultimately leading to a more shallow profile.

Original languageEnglish
Title of host publicationDoping Engineering for Device Fabrication
PublisherMaterials Research Society
Pages119-130
Number of pages12
ISBN (Print)1558998683, 9781558998681
DOIs
Publication statusPublished - 2006
Externally publishedYes
Event2006 MRS Spring Meeting - San Francisco, CA, United States
Duration: 17 Apr 200621 Apr 2006

Publication series

NameMaterials Research Society Symposium Proceedings
Volume912
ISSN (Print)0272-9172

Conference

Conference2006 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/04/0621/04/06

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