Abstract
In this letter, we present the first InGaAs gate-all-around (GAA) nanowire devices fabricated on 300mm Si substrates. For an LG of 60 nm an extrinsic gm of 1030μS/μ m at Vds = 0.5 V is achieved which is a 1.75× increase compared with the replacement fin FinFet process. This improvement is attributed to the elimination of Mg counterdoping in the GAA flow. Ultrascaled nanowires with diameters of 6 nm were demonstrated to show immunity to Dit resulting in an SSSAT of 66 mV/decade and negligible drain-induced barrier lowering for 85-nm LG devices.
| Original language | English |
|---|---|
| Article number | 6914587 |
| Pages (from-to) | 1097-1099 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 35 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 1 Nov 2014 |
| Externally published | Yes |
Keywords
- FinFet
- gate-all-around
- III-V
- InGaAs
- nanowire