InGaAs gate-all-around nanowire devices on 300mm Si substrates

  • Niamh Waldron
  • , Clement Merckling
  • , Lieve Teugels
  • , Patrick Ong
  • , Sheik Ansar Usman Ibrahim
  • , Farid Sebaai
  • , Ali Pourghaderi
  • , Kathy Barla
  • , Nadine Collaert
  • , Aaron Voon Yew Thean

Research output: Contribution to journalArticlepeer-review

Abstract

In this letter, we present the first InGaAs gate-all-around (GAA) nanowire devices fabricated on 300mm Si substrates. For an LG of 60 nm an extrinsic gm of 1030μS/μ m at Vds = 0.5 V is achieved which is a 1.75× increase compared with the replacement fin FinFet process. This improvement is attributed to the elimination of Mg counterdoping in the GAA flow. Ultrascaled nanowires with diameters of 6 nm were demonstrated to show immunity to Dit resulting in an SSSAT of 66 mV/decade and negligible drain-induced barrier lowering for 85-nm LG devices.

Original languageEnglish
Article number6914587
Pages (from-to)1097-1099
Number of pages3
JournalIEEE Electron Device Letters
Volume35
Issue number11
DOIs
Publication statusPublished - 1 Nov 2014
Externally publishedYes

Keywords

  • FinFet
  • gate-all-around
  • III-V
  • InGaAs
  • nanowire

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