Innovative packaging techniques for wearable applications using flexible silicon fibres

Thomas Healy; Julie Donnelly; Brendan O'Neill; Kieran Delaney; Kevin Dwane; John Barton; John Alderman; Alan Mathewson

Innovative packaging techniques for wearable applications using flexible silicon fibres

Thomas Healy
, Julie Donnelly
, Brendan O'Neill
, Kieran Delaney
, Kevin Dwane
, John Barton
, John Alderman
, Alan Mathewson

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

A novel technology [1] that has the potential to make current wearable electronics recede even further into the background of everyday life has been developed in the form of Electronically Functional Fibres (EFF). This is achieved by building a device in silicon on insulator (SOI) [2] material and under-cutting the sacrificial SiO₂ layer by means of an isotropic etch process to leave a freestanding functional fibre. A demonstration of functionality based on this technology was produced in the form of a PN diode on a fibre [3]. One of the key initial considerations involved with this technology is the interconnection of such flexible structures. One approach to resolving this issue is to use a flexible Printed Circuit Board (PCB) and a conductive adhesive paste [4] to interconnect the individual fibres. A prototype demonstration of this technology in the form of a flexible Light Emitting Diode (LED) circuit, using the EFF as the resistor of the circuit, will be presented in this publication.

Original language	English
Pages (from-to)	1216-1219
Number of pages	4
Journal	Proceedings - Electronic Components and Technology Conference
Volume	2
Publication status	Published - 2004
Event	2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: 1 Jun 2004 → 4 Jun 2004

Cite this

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title = "Innovative packaging techniques for wearable applications using flexible silicon fibres",

abstract = "A novel technology [1] that has the potential to make current wearable electronics recede even further into the background of everyday life has been developed in the form of Electronically Functional Fibres (EFF). This is achieved by building a device in silicon on insulator (SOI) [2] material and under-cutting the sacrificial SiO2 layer by means of an isotropic etch process to leave a freestanding functional fibre. A demonstration of functionality based on this technology was produced in the form of a PN diode on a fibre [3]. One of the key initial considerations involved with this technology is the interconnection of such flexible structures. One approach to resolving this issue is to use a flexible Printed Circuit Board (PCB) and a conductive adhesive paste [4] to interconnect the individual fibres. A prototype demonstration of this technology in the form of a flexible Light Emitting Diode (LED) circuit, using the EFF as the resistor of the circuit, will be presented in this publication.",

author = "Thomas Healy and Julie Donnelly and Brendan O'Neill and Kieran Delaney and Kevin Dwane and John Barton and John Alderman and Alan Mathewson",

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note = "2004 Proceedings - 54th Electronic Components and Technology Conference ; Conference date: 01-06-2004 Through 04-06-2004",

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TY - JOUR

T1 - Innovative packaging techniques for wearable applications using flexible silicon fibres

AU - Healy, Thomas

AU - Donnelly, Julie

AU - O'Neill, Brendan

AU - Delaney, Kieran

AU - Dwane, Kevin

AU - Barton, John

AU - Alderman, John

AU - Mathewson, Alan

PY - 2004

Y1 - 2004

N2 - A novel technology [1] that has the potential to make current wearable electronics recede even further into the background of everyday life has been developed in the form of Electronically Functional Fibres (EFF). This is achieved by building a device in silicon on insulator (SOI) [2] material and under-cutting the sacrificial SiO2 layer by means of an isotropic etch process to leave a freestanding functional fibre. A demonstration of functionality based on this technology was produced in the form of a PN diode on a fibre [3]. One of the key initial considerations involved with this technology is the interconnection of such flexible structures. One approach to resolving this issue is to use a flexible Printed Circuit Board (PCB) and a conductive adhesive paste [4] to interconnect the individual fibres. A prototype demonstration of this technology in the form of a flexible Light Emitting Diode (LED) circuit, using the EFF as the resistor of the circuit, will be presented in this publication.

AB - A novel technology [1] that has the potential to make current wearable electronics recede even further into the background of everyday life has been developed in the form of Electronically Functional Fibres (EFF). This is achieved by building a device in silicon on insulator (SOI) [2] material and under-cutting the sacrificial SiO2 layer by means of an isotropic etch process to leave a freestanding functional fibre. A demonstration of functionality based on this technology was produced in the form of a PN diode on a fibre [3]. One of the key initial considerations involved with this technology is the interconnection of such flexible structures. One approach to resolving this issue is to use a flexible Printed Circuit Board (PCB) and a conductive adhesive paste [4] to interconnect the individual fibres. A prototype demonstration of this technology in the form of a flexible Light Emitting Diode (LED) circuit, using the EFF as the resistor of the circuit, will be presented in this publication.

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SN - 0569-5503

VL - 2

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JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 2004 Proceedings - 54th Electronic Components and Technology Conference

Y2 - 1 June 2004 through 4 June 2004

ER -

Innovative packaging techniques for wearable applications using flexible silicon fibres

Abstract

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